SURFACE-TREATED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2020/105289

A1

Provided is a surface-treated copper foil that, in the case of use in the SAP method, can provide a resin substrate with a surface profile that can effectively prevent the generation of deposition that can be produced in a circuit in the step of etching an electroless copper plating layer. The surface-treated copper foil is a surface-treated copper foil that has a treated surface on at least one side thereof. When a resin film is hot-press bonded to the treated surface, the surface shape of the treated surface is transferred to the surface of the resin film, and the surface-treated copper film is then removed by etching, the skewness Ssk for the surface of the remaining resin film, as measured in accordance with ISO 25178, is less than or equal to -0.6.

JP2006005149	CONDUCTIVE SUBSTRATE AND CIRCUIT BOARD MATERIAL WITH RESISTIVE LAYER
WO/2020/250946	ROUGHENED PLATED SHEET
JP6254306	Surface treatment copper foil, copper foil with a career, the manufacturing method of a substrate, a manufacturing method of a printed wired board, a manufacturing method of a printed circuit board, a manufacturing method of a copper-clad laminate sheet

KATO TSUBASA (JP)
MATSUDA MITSUYOSHI (JP)

PCT/JP2019/038866

May 28, 2020

October 02, 2019

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MITSUI MINING & SMELTING CO (JP)

C25D5/16; C25D1/04; C25D5/10; C25D7/00; C25D7/06; H05K3/18; H05K3/38

WO2014038716A1	2014-03-13
WO2017006739A1	2017-01-12
WO2017179416A1	2017-10-19
WO2015033917A1	2015-03-12

JP6293365B2

2018-03-14

TAKAMURA Masaharu et al. (JP)

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