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Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/117339
Kind Code:
A1
Abstract:
A surface-treated copper foil comprising a copper foil and a surface treatment layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the load area ratio SMr2 that separates a protruding valley and the core section of the surface treatment layer is 91-96%.

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WO/2006/079278DECORATIVE LAMINATE, PLATING SOLUTION AND PLATING METHOD FOR FORMING THE DECORATIVE LAYER, AND PRODUCTS USE THIS DECORATIVE LAYER
WO/2005/038989FRETTING AND WHISKER RESISTANT COATING SYSTEM AND METHOD
Inventors:
GOTO IKUHIRO (JP)
Application Number:
PCT/JP2020/038989
Publication Date:
June 17, 2021
Filing Date:
October 15, 2020
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D5/10; C25D5/12; C25D5/16; C25D7/06; H05K1/09; H05K3/38
Foreign References:
JP2019178416A2019-10-17
JP2018090903A2018-06-14
JP2017036495A2017-02-16
JP2014152352A2014-08-25
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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