SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

Title:

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2022/153580

Kind Code:

A1

Abstract:

A surface-treated copper foil which comprises: a copper foil; and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of from 2.50 to 4.50 and an Str of from 0.20 to 0.40.

More Like This:

JP6030322	A coated steel sheet, processed goods, and the panel for flat TV
JPH10194257	STEEL TRAY FOR FOOD, EXCELLENT IN RECYCLING PROPERTIES, SAFETY AND CORROSION RESISTANCE
JP5651912	Manufacturing method of resin-coated steel material

Inventors:

MATSUOKA YUKI (JP)
IWASAWA SHOHEI (JP)
GOTO IKUHIRO (JP)
NAKASHIMA SEIYA (JP)
MIKI ATSUSHI (JP)

Application Number:

PCT/JP2021/026045

Publication Date:

July 21, 2022

Filing Date:

July 09, 2021

Export Citation:

Click for automatic bibliography generation Help

Assignee:

JX NIPPON MINING & METALS CORP (JP)

International Classes:

C23C28/00; C25D3/38; C25D3/58; C25D5/16; C25D7/06

Domestic Patent References:

WO2010110092A1	2010-09-30
WO2018110579A1	2018-06-21
WO2014081041A1	2014-05-30
WO2013047272A1	2013-04-04
WO2018207786A1	2018-11-15
WO2021157362A1	2021-08-12

Foreign References:

JPH06169169A	1994-06-14
JP2014139336A	2014-07-31
JP2014506202A	2014-03-13
JP2021085095A	2021-06-03

Attorney, Agent or Firm:

AXIS PATENT INTERNATIONAL (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: COMMUNICATION DEVICE AND COMMUNICATION METHOD

Next Patent: FILLING DEVICE