SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2023/190833

A1

Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment layer (20) of the surface-treated copper foil (30) is measured according to the method stipulated in ISO25178, the arithmetic mean roughness Sa is 0.04-0.30 μm inclusive. A resin member (40) is affixed onto the surface treatment layer (20) of the surface-treated copper foil (30) and then the surface-treated copper foil (30) is removed by etching, and a measurement of the distilled water contact angle θ1 is carried out according to the sessile drop method stipulated in JIS R3257:1999 on a transfer surface (40a) of the remaining resin member (40), which is the surface to which the surface-treated copper foil (30) was affixed. A measurement of the distilled water contact angle θ0 is carried out on a non-transfer surface of the resin member (40) yet to be affixed onto the surface-treated copper foil (30), the non-transfer surface being the surface onto which the surface-treated copper foil (30) is to be subsequently affixed. The difference θ0-θ1 between the contact angles θ0 and θ1 is 5-35° inclusive.

KATAHIRA SHUSUKE (JP)
SHINOZAKI JUN (JP)
KASAHARA MASAYASU (JP)

PCT/JP2023/013104

October 05, 2023

March 30, 2023

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FURUKAWA ELECTRIC CO LTD (JP)

C25D7/06; B32B15/01; B32B15/08; C23C26/00; C23F1/00; C25D5/14; C25D5/16; H05K1/03; H05K3/26

WO2016104420A1	2016-06-30
WO2011019055A1	2011-02-17
WO2018110579A1	2018-06-21

JP2008542495A

2008-11-27

TANAKA Hidetetsu et al. (JP)

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