Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/158141
Kind Code:
A1
Abstract:
A surface-treated copper foil provided with a copper foil and a surface-treating layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the root mean square slope RΔq of the surface-treating layer is 37 to 70°. A copper-cladded laminate plate provided with a surface-treated copper foil and a resin base material bonded to a surface-treating layer in the surface-treated copper foil.
Inventors:
GOTO IKUHIRO (JP)
MIKI ATSUSHI (JP)
MIYAMOTO NOBUAKI (JP)
MIKI ATSUSHI (JP)
MIYAMOTO NOBUAKI (JP)
Application Number:
PCT/JP2019/046455
Publication Date:
August 06, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; B32B15/20; C25D5/12; C25D5/16; H05K1/09; H05K3/38
Domestic Patent References:
| WO2019208525A1 | 2019-10-31 | |||
| WO2017051906A1 | 2017-03-30 | |||
| WO2017051898A1 | 2017-03-30 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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