SURFACE-TREATED COPPER FOIL FOR FORMING HIGH FREQUENCY SIGNAL TRANSMISSION CIRCUIT, COPPER CLAD LAMINATE BOARD AND PRINTED WIRING BOARD

WIPO Patent Application WO/2016/088884

A1

The purpose of the present invention is to provide a surface-treated copper foil provided with a roughened layer, said surface-treated copper foil exerting no skin effect of the roughened layer in high frequency signal transmission and thus enabling the formation of a circuit capable of achieving a designed signal transmission speed. To solve this problem, provided is a surface-treated copper foil for forming a high frequency signal transmission circuit, said surface-treated copper foil being provided with a roughened layer on the surface of a copper foil, characterized in that the roughened layer has needle- or plate-like minute projections and recesses formed of a copper complex compound containing copper oxide and cuprous oxide, and, when a cross section of the copper foil is observed, the average crystal size is 2.5 μm or greater.

JP6061308	A method for manufacturing at least one functional field on electric contact members, such as switch contact and plug contact
JP5921695	Rust-preventive composition and aqueous dispersion containing it
JPH04505481	[Title of the Invention] Coating method

TSUYOSHI HIROAKI (JP)
HOSOI TOSHIHIRO (JP)

PCT/JP2015/084186

June 09, 2016

December 04, 2015

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MITSUI MINING & SMELTING CO (JP)

C23C26/00; H01B5/02; H05K1/09

WO2014126193A1

2014-08-21

JP2007107037A

2007-04-26

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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