SURFACE-TREATED COPPER FOIL HAVING GRAYED SURFACE, PROCESS FOR PRODUCING THE SAME AND ELECTROMAGNETIC WAVE SHIELDING CONDUCTIVE MESH FOR FRONT PANEL OF PLASMA DISPLAY WHEREIN USE IS MADE OF THE SURFACE-TREATED COPPER FOIL

WIPO Patent Application WO/2005/083157

A1

A surface-treated copper foil that exhibits an excellent gray and can be worked by the common copper etching process; and an electromagnetic wave shielding conductive mesh for PDP produced with the use of the surface-treated copper foil. There is provided, for example, a surface-treated copper foil furnished on its one major surface side with a surface having undergone graying treatment, characterized in that the surface having undergone graying treatment results from formation of a cobalt sulfate plating layer on a rough surface of copper foil layer and further formation of a layer treated for corrosion prevention. Moreover, there is provided, for example, a process for producing the surface-treated copper foil, comprising electrolyzing a cobalt plating solution containing cobalt sulfate (heptahydrate) at a given current density onto a rough surface of electrolytic copper foil, etc. to thereby form a layer treated for corrosion prevention and performing water washing and drying thereof.

HIGUCHI TSUTOMU (JP)

PCT/JP2005/003386

September 09, 2005

March 01, 2005

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MITSUI MINING & SMELTING CO (JP)
HIGUCHI TSUTOMU (JP)

B32B15/01; C23C28/00; C25D7/06; C25D9/04; H05K3/38; H05K9/00; (IPC1-7): C25D7/06; B32B15/01; C23C28/00; H05K9/00

JPH0496393A	1992-03-27
JPH06169168A	1994-06-14
US6224991B1	2001-05-01
JP2003198181A	2003-07-11
JP2004162143A	2004-06-10

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)

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