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Title:
SURFACE-TREATED COPPER FOIL FOR PRINTED CIRCUIT BOARD, COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/099094
Kind Code:
A1
Abstract:
A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, and the BET surface area ratio of the silane-coupling-agent-layer surface is 1.2 or higher.

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Inventors:
SAITO TAKAHIRO (JP)
EZURA TAKESHI (JP)
Application Number:
PCT/JP2016/086282
Publication Date:
June 15, 2017
Filing Date:
December 06, 2016
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C23C26/00; B32B15/04; B32B15/08; C25D5/16; C25D7/06; H05K1/09; H05K3/38
Domestic Patent References:
WO2011090175A12011-07-28
Foreign References:
JPS57184295A1982-11-12
JP2011162860A2011-08-25
JP2008010320A2008-01-17
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
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