Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2018/198905
Kind Code:
A1
Abstract:
The purpose of the present invention is to eliminate adhesion defects caused by press joining of a copper foil with a resin, the copper foil subjected to a silane coupling treatment with an olefin-based silane coupling agent on a roughened surface of the copper foil. In this surface-treated copper foil, the surface roughness Rz of the surface on the roughened layer side is no more than 1.10 μm when measured with a contact-type roughness tester, the minimum auto-correlated length Sal of the surface on the roughened layer side is 0.20 μm to 0.85 μm inclusive, and the interface developed area ratio (Sdr) of the surface on the roughened layer side is in a range of 20-300%.
Inventors:
TSURUTA TAKAHIRO (JP)
UNO TAKEO (JP)
OKUNO YUKO (JP)
UNO TAKEO (JP)
OKUNO YUKO (JP)
Application Number:
PCT/JP2018/015995
Publication Date:
November 01, 2018
Filing Date:
April 18, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; B32B15/08; C23C28/00; C25D5/16; H05K3/38
Domestic Patent References:
| WO2014081041A1 | 2014-05-30 | |||
| WO2016174998A1 | 2016-11-03 | |||
| WO2016117498A1 | 2016-07-28 |
Foreign References:
| JP2015013474A | 2015-01-22 | |||
| JP2015105421A | 2015-06-08 | |||
| JP4927963B2 | 2012-05-09 | |||
| JP2011216598A | 2011-10-27 | |||
| JP2003201585A | 2003-07-18 | |||
| JP2005190945A | 2005-07-14 | |||
| JP2013155415A | 2013-08-15 | |||
| JPH08309918A | 1996-11-26 |
Attorney, Agent or Firm:
SUZUKI Sohbe et al. (JP)
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