Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2022/176648
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil which can achieve a desired small transmission loss even in a high-frequency region while keeping the peel strength thereof from a resin substrate. The surface-treated copper foil according to the present invention comprises an electrolytic copper foil, at least one roughened layer that covers one surface side of the electrolytic copper foil, a rust-proof layer that further covers the at least one roughened layer, and a silane-coupling-agent-treated layer that covers the rust-proof layer, in which a developed interfacial area ratio Sdr is 40% or less, an arithmetic mean peak curvature Spc is 200 mm-1 or less, and a root mean square gradient Sdq is 0.30 to 0.90 on a surface on the above-mentioned one surface side of the surface-treated copper foil (i.e., a surface that is to be bonded to a resin substrate, also referred to as a resin-substrate-bonding surface), or the average particle diameter of particles is 0.50 μm or less and the average particle length of the particles is 0.40 to 0.70 μm on the above-mentioned bonding surface of the surface-treated copper foil.
Inventors:
ENDO YASUHIRO (JP)
MOROE SHOTA (JP)
KINOSHITA SAYAKA (JP)
MOROE SHOTA (JP)
KINOSHITA SAYAKA (JP)
Application Number:
PCT/JP2022/004464
Publication Date:
August 25, 2022
Filing Date:
February 04, 2022
Export Citation:
Assignee:
NIPPON DENKAI LTD (JP)
International Classes:
C25D7/06; B32B9/00; B32B9/04; B32B15/01; B32B15/04; B32B15/20; C23C28/00; C25D5/10; C25D7/00; H05K1/03
Foreign References:
| JP2016089192A | 2016-05-23 | |||
| JP2015061939A | 2015-04-02 | |||
| JP2018141228A | 2018-09-13 |
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
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