Title:
SURFACE-TREATED COPPER MATERIAL, COPPER-CLAD LAMINATE, METHOD FOR PRODUCING SURFACE-TREATED COPPER MATERIAL, AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/013552
Kind Code:
A1
Abstract:
This invention addresses the problem of improving the retention of adhesive strength between the surface of a surface-treated copper material and resin component(s) bonded to said surface after being exposed to a high temperature environment for a long period. The surface-treated copper material has an oxide surface comprising cuprous oxide and copper oxide. For the oxide surface, the sum of the thickness (T1) of the cuprous oxide and the thickness (T2) of the copper oxide determined by sequential electrochemical reduction analysis is 1-40 nm, and the ratio (T2/T1) of the thickness (T2) of the copper oxide to the thickness (T1) of the cuprous oxide is 1-9.
Inventors:
KITATSUKA MANAMI (JP)
Application Number:
PCT/JP2022/029333
Publication Date:
February 09, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
UBE EXSYMO CO LTD (JP)
International Classes:
C23C8/12; B32B9/00; B32B15/04; H05K1/03
Foreign References:
| JPH07109558A | 1995-04-25 | |||
| JP2016018653A | 2016-02-01 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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