Title:
SURFACE-TREATED PLATED MATERIAL, CONNECTOR TERMINAL, CONNECTOR, FFC TERMINAL, FFC, FPC AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/138928
Kind Code:
A1
Abstract:
Provided is a surface-treated plated material, in which formation of whiskers is suppressed, which maintains good solderability and low contact resistance even when exposed to high temperature environments, and for which the insertion force of a terminal or connector is low. The surface-treated plated material comprises a plated material in which an upper layer is provided on a base material and the upper layer contains Sn or In, a surface of the plated material contains a compound represented by a prescribed general formula and a compound represented by a prescribed general formula, and one or more compounds selected from among a group of constituent compounds D represented by another prescribed general formula are caused to adhere to the upper layer side surface of the plated material.
Inventors:
KODAMA ATSUSHI (JP)
ENDO SATORU (JP)
ENDO SATORU (JP)
Application Number:
PCT/JP2017/003243
Publication Date:
August 02, 2018
Filing Date:
January 30, 2017
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D5/48; B32B15/04; C23C28/00; C25D5/12; C25D7/00; H01R13/03
Domestic Patent References:
| WO2015056554A1 | 2015-04-23 |
Foreign References:
| JP2015045045A | 2015-03-12 | |||
| JPH04314896A | 1992-11-06 | |||
| JPH04314897A | 1992-11-06 | |||
| JP2005240093A | 2005-09-08 | |||
| JP2004360004A | 2004-12-24 | |||
| JP2007197791A | 2007-08-09 |
Other References:
See also references of EP 3575446A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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