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Patent Searching and Data


Title:
SURFACE TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/148685
Kind Code:
A1
Abstract:
Disclosed is a surface treatment apparatus that is provided with: either one of a positive electrode member and a negative electrode member, which are electrically connected to a metallic subject to be treated, said subject having, on the outer circumferential surface, an annular region to be treated; a frame member, which is provided with the nonconductive inner circumferential surface that faces, with a gap therebetween, the outer circumferential surface and the annular region to be treated; a nonconductive elastic seal material, with which an electrolyte path can be formed along the annular region to be treated, by sealing the gap between the outer circumferential surface portions and the inner circumferential surfaces, said outer circumferential surface portions having the annular region therebetween; the other one of the bar-like positive electrode member and the negative electrode member, which protrude toward the subject to be treated such that the leading end portion of the member enters the electrolyte path; and an electrolyte circulating means, which makes the electrolyte circulate along the electrolyte path.

Inventors:
KOBAYASHI DAISHI (JP)
KATO MASAKI (JP)
TATSUMOTO KAZUHIRO (JP)
Application Number:
PCT/JP2011/054920
Publication Date:
December 01, 2011
Filing Date:
March 03, 2011
Export Citation:
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Assignee:
AISIN SEIKI (JP)
KOBAYASHI DAISHI (JP)
KATO MASAKI (JP)
TATSUMOTO KAZUHIRO (JP)
International Classes:
C25D17/00; C25D5/02; C25D11/00
Foreign References:
JP2008291302A2008-12-04
JP2003147587A2003-05-21
JP2003119593A2003-04-23
JP2003119593A2003-04-23
Attorney, Agent or Firm:
KITAMURA SHUICHIRO (JP)
Shuichiro Kitamura (JP)
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Claims: