SURFACE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

Title:

SURFACE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/220190

Kind Code:

A1

Abstract:

A surface treatment method for removing a metal oxide film on a metal layer surface and a substrate treatment device are provided.　This surface treatment method is for surface treatment of a substrate having a metal layer, said method comprising a step of supplying a metal complex compound containing cyclopentadienyl ligands to a treatment chamber and a step of removing the metal oxide film on the metal layer surface by using the metal complex compound.

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Inventors:

MURAKAMI HIROKI (JP)
AZUMO SHUJI (JP)
KAWANO YUMIKO (JP)

Application Number:

PCT/JP2022/017252

Publication Date:

October 20, 2022

Filing Date:

April 07, 2022

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

C23C16/02; C23C16/18

Domestic Patent References:

WO2020189288A1

2020-09-24

Foreign References:

JP2016167545A

2016-09-15

Attorney, Agent or Firm:

ITOH, Tadashige et al. (JP)

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