SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE

WIPO Patent Application WO/2023/149581

A1

The purpose of the present invention is to provide: a surface treatment solution that does not contain Si atoms and shows almost no deterioration in adhesion even when applied to the surface of a resin and left on the surface-treated resin in a non-dry atmosphere for several days before lamination and compression; and a method for manufacturing a surface-treated resin substrate and a resin film laminate.　The surface treatment solution of the present invention contains a compound α and a polymer having a repeating unit having a primary amino group or an imino group, has a pH of 4.5 or less at 25°C, and is used by being applied to a resin for interfacial molecular bonding. The compound α has an azide group, a diazomethyl group or azidosulfonyl group, and an OH group or alkoxy group in one molecule. The surface treatment solution preferably further contains an acid or an anhydride thereof having an acid dissociation constant pKa of 4.0 or less. It is preferable that the compound α has a carbonyl group and the carbonyl group is directly bonded to the OH group or alkoxy group. It is also preferable that the compound α has a benzene ring and the azide group or the like is directly bonded to the benzene ring.

KURAMITSU HIROSHI (JP)
YASU KATSUHIKO (JP)
INOUE TOSHINORI (JP)
HIRABAYASHI MITSUNOBU (JP)
MITSUDA KAZUHIRO (JP)

PCT/JP2023/003885

August 10, 2023

February 06, 2023

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HOKOSHA TECH CORPORATION (JP)

C08J7/043; B32B27/00; C08J7/00; C08J7/02; C09D7/63; C09D179/02; C09D201/02; C09J11/06; C09J179/02; C09J201/02

JPH03141300A	1991-06-17
JP2020521574A	2020-07-27
JP6438747B2	2018-12-19
JP2016047849A	2016-04-07

MIKI Hisami et al. (JP)

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