SURFACE WAVE SENSOR DEVICE - MURATA MANUFACTURING CO

Title:

SURFACE WAVE SENSOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/114829

Kind Code:

A1

Abstract:

A surface wave sensor device where an undesired short circuit or deterioration in measurement precision due to liquid adhesion is less likely to occur and that provides highly reliable measurement results. A surface sensor device (1), where elastic surface wave elements (11, 21) are bonded, with thermo-compressive bonding anisotropic conductive sheets (7, 8) in between, on the first major surface (2a) side of a base substrate (2) having first through-hole conductors (5a, 5b, 6a, 6b), electrodes such as IDTs (13, 14) are formed on the first major surface (12a, 22a) side of piezoelectric substrates (12, 22) of the elastic surface wave elements (11, 21), the electrodes being led out to the second major surface (12b, 22) side through second through-hole conductors (16a, 16b, 26a, 26b) arranged in the piezoelectric substrates (12, 22), and the first through-hole conductors (5a, 5b, 5e, 5f) are arranged superposed on the second through-hole conductors (16a, 16b, 26a, 26b) with the thermo-compressive bonding anisotropic conductive sheets (7, 8) in between.

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Inventors:

KADOTA MICHIO (JP)
FUJIMOTO KOJI (JP)

Application Number:

PCT/JP2005/006774

Publication Date:

November 02, 2006

Filing Date:

April 06, 2005

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
KADOTA MICHIO (JP)
FUJIMOTO KOJI (JP)

International Classes:

G01N5/02; G01N29/02; G01N33/543; (IPC1-7): G01N29/18

Foreign References:

JPH09512345A	1997-12-09
JP2003502616A	2003-01-21

Other References: