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Title:
SYNDIOTACTIC POLYSTYRENE LOW DIELECTRIC SHEET MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/182464
Kind Code:
A1
Abstract:
[Problem] To provide a sheet molded body that has excellent dielectric properties and solder heat resistance, and that also exhibits a low dimensional change rate (low thermal shrinkage) and a low linear expansion coefficient. [Solution] A sheet molded body containing a styrene-based polymer (A) having a syndiotactic structure, a fibrous filler (C), and a non-fibrous filler (D), wherein: the sheet molded body is unstretched and contains 1-50 parts by mass of the fibrous filler (C) with respect to 100 parts by mass of the styrene-based polymer (A) having a syndiotactic structure; and the relative permittivity of the sheet molded body in a frequency band of 10 GHz is 3 or less.

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Inventors:
MAEDA YUKI (JP)
KURITA TOMOHARU (JP)
IRIE MICHIHIKO (JP)
TOGAWA KEIICHIRO (JP)
HIRONAKA NOBUYUKI (JP)
Application Number:
PCT/JP2023/011656
Publication Date:
September 28, 2023
Filing Date:
March 23, 2023
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L25/04; C08K3/013; C08K7/02; C08K7/14; C08L21/00; C08L23/02
Foreign References:
JP2000040421A2000-02-08
JP2011246671A2011-12-08
JPH03134052A1991-06-07
JP2020047731A2020-03-26
JPH11279347A1999-10-12
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