Title:
SYSTEM-IN-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/022431
Kind Code:
A1
Abstract:
The present application relates to the technical field of semiconductor encapsulation, and in particular to a system-in-package structure and a manufacturing method therefor, and an electronic device. The manufacturing method for a system-in-package structure in the present application comprises the following steps: providing a template, the template being provided with a through hole; filling the through hole with a conductive material; providing a substrate, the substrate being provided with a pad; and the sintered conductive material forming a conductive column, one end of which is electrically connected to the pad. The manufacturing method in the present application has a simple process flow, is efficient, is reliable, has a low cost, and is easily popularized and applied. The present application can alleviate the problems of a high cost, a low efficiency and a complicated operation existing in an existing encapsulation method.
Inventors:
MA HUICAI (CN)
SHE YONG (CN)
XIAO TIAN (CN)
SHE YONG (CN)
XIAO TIAN (CN)
Application Number:
PCT/CN2021/108316
Publication Date:
February 03, 2022
Filing Date:
July 26, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/48
Foreign References:
| US5551148A | 1996-09-03 | |||
| CN104465611A | 2015-03-25 | |||
| CN111279473A | 2020-06-12 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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