Technical field

The present application relates to a system for a surface treatment of a substrate with a fluid and a method for a surface treatment of a substrate with a fluid. The surface treatment may be a chemical processing, a plating and in particular an electroplating.

Background

In order to achieve adequate film quality and uniformity during an electroplating process to deposit one or multiple materials like metals (e.g. Cu) onto at least one side of a substrate, it is especially essential to guarantee very good electrical contacts to one or multiple surfaces of the substrate (usually functioning as the cathode), where in many cases a conductive seedlayer is already present to distribute the current density over the surface area(s) of the substrate. This is achieved by mounting the substrate for the electroplating process to a substrate holder (chuck), which usually clamps the substrate in-between two relative to each other moveable parts, one on each side of the substrate. This chuck is functioning as the source for the electrical contacts and also as a handling support to be able to transfer the substrate from the loading/unloading station (chucking station) through the electrolyte plating system, comprising e.g. the whole required process sequence (including electroplating, rinsing and drying), and back to the chucking station. Chucks can also be designed to handle multiple substrates simultaneously.

Commonly, the inner workings of a chuck (e.g. electrical contacts, locking mechanisms) as well as the parts of the substrate, which are not supposed to be electroplated or get in contact with liquid chemistries are sealed from the mostly acidic electrolyte through seals or lip seals attached to specific chuck areas as required.

However, even so the lip seals are designed appropriately and optimized for functionality, it still happens on occasions that during an electroplating process some amount of electrolyte plating chemistry can creep in-between and also through the lip seal formed with the substrate. This electrolyte contamination can then to be found within the inside of the chuck/substrate system and cannot be removed anymore during the rinsing and drying process after the electroplating process and can cause significant issues during the subsequent processing steps. These problems may include:

(1) contamination of the chucking station during unloading of the substrate from the chuck, which can even lead to a significant damage of the chucking station,

(2) drying stains from residual chemistries on the substrate,

(3) cross contamination of other substrates through a use of chemically contaminated chucks,

(4) material deposition (during the electroplating process) as well as etching/corrosion of the substrate in areas where no etching should occur (after the electroplating process), and

(5) risk of serious injuries of engineers and operator working with the equipment, etc.

The challenge of electrolyte leakage through the lip seals is present for all types of substrates, from round shaped wafers up to very large, square or rectangular glass panels, where the issue may increase in severity with increasing overall size of the substrate.

State-of-the-art chucks are consisting of mostly two frame parts, an upper and a lower halfframe in-between which the substrate is being sandwiched through mechanical force, pressing electrical contacts to the substrate surface, which may be prepared with a seed-layer for the electroplating process. Some frame parts are clamped together, some must be even manually screwed together.

To avoid that electrolyte is leaking inside the chuck into areas, where it may cause harmful effects and/or cannot be removed anymore through standard processing, very often lip seals are being used in-between chuck parts and substrate surfaces (dry-contact chucks).

State-of-the art chucks are applying a mechanical force through complex geometry clamping systems to ensure a secure fixation of the substrate and are typically based on a design, which requires a significant amount of screws to be fastened manually. Such manual fastening processes very often lead to non-homogeneous forces being exerted onto the substrate and, therefore, very often result in unreliable sealing and protection of an interior of the chuck against being contacted by the electrolyte chemistry.

Even with a fully automated and optimized loading and unloading of the substrates, including automatic sealing of the chuck to the substrate, it can happen that during the electroplating process some amount of electrolyte can creep into the protected chuck area. In state-of-the-art systems, leakage of electrolyte is routinely almost impossible to avoid. Summary

Hence, there may be a need to provide an improved system for a surface treatment of a substrate with a fluid, which allows a better handling (in other words, management) of leakage issues.

The problem is solved by the subject-matters of the independent claims of the present application, wherein further embodiments are incorporated in the dependent claims. It should be noted that the aspects of the application described in the following apply also to the system for a surface treatment of a substrate with a fluid and the method for a surface treatment of a substrate with a fluid.

According to the present application, a system for a surface treatment of a substrate with a fluid is presented. The system for a surface treatment of a substrate with a fluid comprises a substrate holder, a cover, and a treatment chamber.

The substrate holder is configured to hold the substrate to be treated.

The cover is attachable to the substrate holder and configured to cover the substrate at least partially.

The treatment chamber comprises a rinsing unit configured to rinse the cover. The rinsing unit is further configured to handle the cover relative to the substrate holder. The treatment chamber further comprises a drying unit configured to dry the cover.

The present system for a surface treatment of a substrate with a fluid may allow a better management of leakage issues and may avoid the above-mentioned problems by preventing any leaked electrolyte, which got into inner workings of a substrate holder- substrate system (for instance a combination of the cover, substrate and substrate holder), to reach an outside of the electrolyte chamber. This is achieved by a combination of the cover, the rinsing unit and the drying unit. So even when electrolyte is entering into areas of the substrate holder, where it is not supposed to get, the present system is designed to permit a removal of this electrolyte contamination through an efficient and effective rinsing and drying of all parts of the substrate holder-substrate system (specifically the cover). By rinsing and drying only the cover a contamination inside the substrate holder may be effectively removed. This may eliminate the risk that unwanted parts of the equipment are contaminated and cause damage or even dangerous safety situations. The efficient and effective rinsing and drying may even be achieved without significantly increasing a rinsing and drying time and without leaving drying residues (like water stains). The present system for a surface treatment of a substrate with a fluid may also enable a processing of very large substrates of the so called G8 to GIO panel generation even as the issue of sealing would conventionally increase in severity with increasing the overall size of the substrate. Very large substrates of the so called G8 to GIO panel generation can be understood as substrates of 2160 to 2880 mm length and 1800 to 3130 mm width. Also even larger substrates can be handled. Substrates of any shape can be handled, as e.g. round or square or rectangular wafers or glass panels of several meters length on each side.

The present system for a surface treatment of a substrate with a fluid may enable a fast and reliable manual or automatic loading and un-loading of substrates and in particular of very large substrates. The present system for a surface treatment of a substrate may further guarantee excellent and stable electrical contacts.

The substrate holder or chuck can be understood as a holding part adapted to hold one or more substrates to be treated. The substrate holder may therefore comprise a frame-shaped component, a plate-shaped component and/or combinations thereof. It may comprise only one or several cover components.

The cover can be understood as a shielding part attachable or attached to the substrate holder to shield the substrate. The substrate may be held between the substrate holder and the cover. The cover may cover the substrate partially or completely. The cover may therefore be formed like a plate or a hull. It may comprise only one or several cover components. The cover may also be configured to fix electrical contacts of the substrate holder and/or the substrate. The cover may also be configured to protect the electrical contacts and/or other inner workings of the substrate holder-substrate system from e.g. an electrolyte chemistry.

The treatment chamber can be understood as a room or space (which may be closed from all sides to the surroundings) for treating or processing at least one substrate. The treatment chamber may be sized and formed to house the at least one substrate and preferably also at least partially a treatment device as e.g. a rinsing unit, a drying unit and the like. The treatment chamber can be understood as a Substrate-Rinse-Dry (SRD) Chamber.

The treatment chamber comprises at least partially the rinsing unit to rinse the cover and/or at least partially the drying unit to dry the cover. The rinsing unit may be at least a spray plate, a spray bar, a waterfall system or the like. The rinsing unit may be moveable or fixed. The rinsing unit might comprise only one or at least two rinsing elements, for example, one moveable and one fixed. The drying unit may be a fan, an air knife or the like. The drying unit may be moveable or fixed. The drying unit might comprise only one or at least two drying elements, for example, one moveable and one fixed. An operation and/or a movement of the elements of the rinsing unit and/or the drying unit can be coordinated with each other.

The handling of the cover relative to the substrate holder by means of the rinsing unit can be understood as a movement and/or an attachment and/or a detachment of the cover relative to the substrate holder.

In an embodiment, the rinsing unit is moveable relative to the substrate holder between a retracted position and an extended position. In the retracted position, the rinsing unit may be configured to hold the cover. In the extended position, the rinsing unit may be configured to attach or detach the cover in the treatment chamber to or from the substrate holder.

This means the rinsing unit is not only configured for rinsing, but also for holding and moving the cover relative to the substrate holder. Such multifunction of the rinsing unit makes the present system for a surface treatment very efficient. Advantageously, the rinsing unit may carry and at the same time rinse the cover. Accordingly, both the space in the treatment chamber may be used more efficiently and the processing time may be reduced.

The rinsing unit holding the cover may be moveable from a distinct, remote or retracted position towards the substrate holder into a close, extended or contact position relative to the substrate holder. The rinsing unit may thereby be configured to transport the cover to the substrate holder and to load and connect the cover to the substrate holder. The cover may be attached to the substrate holder by means of vacuum, reduced pressure, magnetic, electromagnetic, mechanical and/or other forces. After the cover is mounted to the substrate holder, the rinsing unit may be configured to move backwards and return into the retracted position, which is also a rinsing position, in which the cover may be rinsed by means of the rinsing unit.

The rinsing unit may be arranged in an opening of the treatment chamber. The rinsing unit may be configured to hold the cover by means of vacuum, reduced pressure, magnetic field(s), mechanical clamping, a Bernoulli holder and/or the like. These holding means for the cover at the rinsing unit may at least partially be arranged in an opening of the rinsing unit (in an extended position). Holding means in form of a Bernoulli holder may be configured for an essentially contactless holding, which may be understood as holding or supporting essentially without touching or getting in contact. This means specific or sensitive parts or functional structures or a largest area of the held component are not touched. Instead, the held component may be touched at edge(s), corner(s) or particular designated (exclusion) zone(s) or small areas(s).

In an embodiment, the system for a surface treatment of a substrate with a fluid further comprises a retractable blind. The blind may be a roller blind. The blind may be arranged in the treatment chamber between the rinsing unit and the substrate holder to shield the cover held by the rinsing unit in the retracted position of the rinsing unit.

This can be understood in that the cover is stored inside the treatment chamber behind or covered by the blind, which is in an extended position. Once the substrate holder is in place inside the treatment chamber, the blind may be retracted or pulled out of the way between the substrate holder and the rinsing unit holding the cover. In other words, the blind is moved into the retracted position. Then, the rinsing unit holding the cover may be moved from its retracted position towards the substrate holder into its extended position. The rinsing unit may thereby transport the cover to the substrate holder and load and connect the cover to the substrate holder. After the cover is mounted to the substrate holder, the rinsing unit may move back into its retracted position.

In an embodiment, the retractable blind comprises a hydrophobic first surface directed towards the rinsing unit in the retracted position. The hydrophobic first surface may avoid droplets being created on the blind. The first surface may also be hydrophilic. The retractable blind may comprise alternatively or additionally a hydrophobic or hydrophilic second surface directed towards the substrate. In all cases, the hydrophobic or hydrophilic surface may be achieved by a specific microstructure of the surface, in other words a physical microstructuring of the surface.

In an embodiment, the system for a surface treatment of a substrate with a fluid further comprises a motion unit configured to move the substrate holder into and out of the treatment chamber. The motion unit may be at the same time configured to move the substrate holder relative to the drying unit.

In an embodiment, the system for a surface treatment of a substrate with a fluid further comprises at least an anti-drop pin. The anti -drop pin may be formed for holding the cover, the substrate holder and/or the substrate together. The anti -drop pins are therefore arranged at the rinsing unit in a location to be positioned along a frame or edge of the cover. The antidrop pin(s) may prevent the substrate from getting damaged in case another holding system for the cover, the substrate holder and/or the substrate fails, as e.g. mechanic or magnetic forces fail. The anti-drop pin may be further configured to allow rinsing and drying of the cover thoroughly for cleaning of the contaminated areas inside the substrate-substrate holder system. The anti-drop pin may comprise a cylindrical shaped pin body configured to extend through the rinsing unit and a suction surface configured to contact and hold the cover and/or the substrate holder at a receiving surface of the rinsing unit. The suction surface may be connected by means of a vacuum channel extending through the pin body to a pump or source of reduced pressure or vacuum. The pump or source of reduced pressure or vacuum may be controlled based on data from a sensor detecting the presence of a cover, a substrate holder and/or a substrate, e.g. a contact or pressure sensor. The suction surface may comprise at least a protrusion configured to be inserted into a recess or hole of the cover and/or the substrate holder. A free end of the protrusion may comprise a barb disk to retain the cover, the substrate holder and/or the substrate.

According to the present application, also a method for a surface treatment of a substrate with a fluid is presented. The method for a surface treatment of a substrate with a fluid comprises the following steps, not necessarily in this order: providing a substrate holder configured to hold the substrate to be treated, providing a cover, which is attachable to the substrate holder and configured to cover the substrate at least partially, rinsing the cover in the treatment chamber by means of a rinsing unit, drying the cover in the treatment chamber by means of a drying unit, and handling the cover relative to the substrate holder by means of the rinsing unit.

The handling of the cover relative to the substrate holder by means of the rinsing unit can be understood as a movement and/or an attachment and/or a detachment of the cover relative to the substrate holder. Such handling can be done at various steps within the present method for a surface treatment of a substrate.

An attachment of the cover to the substrate holder can be done before the rinsing and drying. A detachment of the cover from the substrate holder can be done after the rinsing and drying. An attachment of the cover to the substrate holder can be done after a detachment of the cover from the substrate holder. A detachment of the cover from the substrate holder can be done after a further rinsing and drying.

The present method for a surface treatment of a substrate with a fluid may allow a better handling of leakage issues and may avoid any leaked electrolyte, which got into inner workings of a substrate holder-substrate system, to reach an outside of the electrolyte chamber. So even when electrolyte is entering into areas of the substrate holder, where it is not supposed to get, the present method is designed to permit a removal of this electrolyte contamination through an efficient and effective rinsing and drying of all parts of the substrate holder-substrate system.

In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of loading the substrate to the substrate holder. The loading of the substrate to the substrate holder can be done outside the treatment chamber before inserting the substrate holder with the substrate into the treatment chamber. The substrate may be handled by e.g. a robotic handler from a loading station from a FOUP (Front Opening Unified Pod or Front Opening Universal Pod), from an open cassette or from a stack (comprising trays and panels) into or onto the substrate holder. The substrate may then be mounted to the substrate holder by means of e.g. vacuum, reduced pressure relative to the environment, mechanic components (clamps, screws, etc.), magnetic components (permanent magnets, magnetic materials, electro-magnetic units, etc.) and the like.

The loading of the substrate to the substrate holder can also be done inside the treatment chamber. In an embodiment, the method for a surface treatment of a substrate with a fluid then comprises the steps of inserting the substrate into the treatment chamber, and loading the substrate to the substrate holder.

This can be understood in that the substrate without being mounted to a substrate holder is moved into the treatment chamber. The loading of the substrate to the substrate holder happens afterwards inside the treatment chamber. The loading of the substrate to the substrate holder can be done before attaching the cover to the substrate holder.

The substrate may be handled and inserted into the treatment chamber by a first, e.g. robotic, handler from a loading station from e.g. a FOUP, an open cassette or a stack into the treatment chamber. The first, robotic handler can make use of a multi-axis handling or an (indirect) y-z axis handling technology. Also a manual or partially manual handling is possible.

Once the substrate is at a correct position inside the treatment chamber, the first, e.g. robotic, handler may hand the substrate over to another, second handler, e.g. a Bernoulli handler, in a handover position. The first handler may move back out of the treatment chamber. The second (e.g. Bernoulli) handler holding the substrate may move the substrate into or onto the substrate holder. The handling of the substrate inside and outside the treatment chamber can be done by two or more handlers, but also by only one handler. The substrate may be mounted to the substrate holder by means of e.g. vacuum, reduced pressure relative to the environment, mechanic components, magnetic components and the like. After the substrate is inserted in to the treatment chamber and loaded to the substrate holder, the substrate holdersubstrate system is formed.

The substrate holder may be permanently stored in the treatment chamber and positioned to wait for the substrate. Also all required parts for mounting the substrate to the substrate holder (one substrate or even two substrates in case of a double side holding) and/or for preparing the substrate to be able to function as a cathode in an electrolytic process can be placed and stored inside the treatment chamber. These parts can comprise the substrate holder, electrical contacts, the handler to load and hold the substrate to and in the substrate holder, etc.

Either with or without substrate, the substrate holder may be moved into the treatment chamber. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the step of inserting the substrate holder into the treatment chamber. This can be done in a first case with cover and therefore after attaching the cover to the substrate holder. The inserting of the substrate holder into the treatment chamber can also be done in a second case without cover. The inserting of the substrate holder into the treatment chamber is then done before attaching the cover to the substrate holder.

In the first case (inserting of the substrate holder with cover into the treatment chamber), the attachment of the cover to the substrate holder is done outside the treatment chamber before inserting the substrate holder into the treatment chamber. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of mounting the cover to the substrate holder outside the treatment chamber, and inserting the substrate holder with the cover into the treatment chamber.

This can be understood in that the substrate holder with cover and with or without substrate is loaded into the treatment chamber.

In the second case (inserting of the substrate holder without cover into the treatment chamber), the cover may be attached to the substrate holder within the treatment chamber. The cover may therefore be inserted into the treatment chamber or may be stored in the treatment chamber and positioned to wait for the substrate holder. The handling of the cover relative to the substrate holder can be done by means of the rinsing unit. The rinsing unit may therefore be moveable. The rinsing unit may be a (moveable) spray plate. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the rinsing unit from a retracted position into an extended position relative to the substrate holder, wherein the rinsing unit holds the cover, and handling the cover in the treatment chamber from the rinsing unit to the substrate holder to attach the cover to the substrate holder.

This means the rinsing unit cannot only be used for rinsing, but also for holding and moving the cover relative to the substrate holder. Such multifunction of the rinsing unit makes the present method for a surface treatment very efficient.

The rinsing unit holding the cover may be moved from a distinct, remote or retracted position towards the substrate holder into a close, extended or contact position relative to the substrate holder. The rinsing unit may thereby transport the cover to the substrate holder and load and connect the cover to the substrate holder. After the cover is mounted to the substrate holder, the rinsing unit may move backwards and return into the retracted position, which is also a rinsing position, in which the cover may be rinsed be means of the rinsing unit.

The rinsing unit may be arranged in an opening of the treatment chamber. The rinsing unit may hold the cover by means of vacuum, reduced pressure, magnetic field(s), mechanical clamping, above mentioned or another Bernoulli holder and/or the like. These holding means for the cover at the rinsing unit may at least partially be arranged in an opening of the rinsing unit (in an extended position).

The cover may be attached to the substrate holder (and optionally to the substrate) by means of vacuum, reduced pressure, magnetic, electromagnetic, mechanical and/or other forces. A compound of cover, substrate and substrate holder can be understood as fully mounted substrate holder-substrate system ready for e.g. chemical processing with inner workings of the substrate holder- sub str ate system protected from potential chemical and/or environmental attacks.

Also all additional parts for a final assembly of the fully mounted (dry contact) substrate holder- substrate system to prepare the substrate to function as a cathode in an electrolytic process can be held and handled inside the treatment chamber. This may comprise an attachment of another cover component to fix and seal electrical contacts. In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of retracting a blind between the rinsing unit and the substrate holder before moving the rinsing unit from the retracted position into the extended position. This can be understood in that the cover is stored inside the treatment chamber behind or covered by the blind, which is in an extended position. The blind may be a roller blind. Once the substrate holder (and the substrate) is in place inside the treatment chamber, the blind may be retracted or pulled out of the way between the substrate holder and the rinsing unit holding the cover. In other words, the blind is moved into a retracted position. Then, the rinsing unit holding the cover may be moved from its retracted position towards the substrate holder into its extended position. The rinsing unit may thereby transport the cover to the substrate holder and load and connect the cover to the substrate holder. After the cover is mounted to the substrate holder, the rinsing unit may move backwards and return into its retracted position.

The blind can comprise a thin layer with a microstructure surface. The microstructure surface may turn the blind surface into a hydrophobic or hydrophilic surface depending on its physical micro-structuring. The blind may comprise a preferably hydrophobic surface directed towards the rinsing unit in the retracted position, but also a hydrophilic surface directed towards the rinsing unit in the retracted position. The blind may comprise a preferably hydrophobic, but also a hydrophilic surface directed towards the substrate.

For example, after the substrate holder with the substrate is inserted into the treatment chamber and protected by the cover, a processing of the substrate holder-substrate system may follow. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the step of pre-wetting the substrate. The pre-wetting can be done within the treatment chamber. The pre-wetting can be done by means of the rinsing unit, e.g. the movable spray plate, which moves from a handling position for handling and attaching the cover to the substrate holder into a process position for pre-wetting. The pre-wetting can be understood as a rinsing of the substrate holder and substrate with a liquid (e.g. DI water). This may allow removing gas bubbles from the substrate surface and in particular from recess or holes in the substrate surface.

For example, when the processing in the treatment chamber is completed, the substrate holder with the substrate and the cover may be removed from the treatment chamber and moved into a processing chamber different to the treatment chamber. In the processing chamber, a chemical processing of the substrate may take place. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the substrate holder and the cover out of the treatment chamber and into a processing chamber for a chemical processing of the substrate, and moving the substrate holder and the cover out of the processing chamber and back into the treatment chamber before rinsing and drying the cover.

The chemical processing may be an electrolytic processing, as e.g. an electroplating with a metal deposition. For example, a metal film may be deposited on the substrate (e.g. Cu). The chemical processing may also be an acid, high-pH or solvent based chemical processing for e.g. developing, removing or cleaning materials or contaminants. The chemical processing may comprise only one or more steps or different procedures. It can be done in the same or in several processing chambers.

After the chemical processing, the substrate holder with the substrate and the cover may be removed from the processing chamber and moved back into the treatment chamber. In the treatment chamber, the rinsing and/or drying may follow.

In the treatment chamber, the cover may be rinsed from chemical residues by means of e.g. spraying a rinsing fluid onto the cover through the rinsing unit (e.g. a spray plate or spray bars) and/or supplying a rinsing fluid onto the cover through the rinsing unit (e.g. a waterfall system or spray bars).

In the treatment chamber, the cover may be dried from any liquids and strains by means of a drying unit (e.g. a fan, an air knife or the like). For example, the drying is carried out by directing a gas flow of a fan to the substrate holder, the substrate and the cover. For example, the drying is carried out by moving the substrate holder, the substrate and the cover through an air knife processing zone upwards (cover drying step). An additional drying-support step can take place e.g. by applying a drying supporting chemistry as e.g. iso-propyl alcohol in liquid form, as a vapor, vapor-spray, mist or the like to the surface(s) to be dried.

The rinsing and/or drying may be achieved or supported by a relative movement between the rinsing unit and/or the drying unit on the one hand and the substrate holder with the cover (and the substrate) on the other hand. This means the rinsing unit, the drying unit and/or the substrate holder with the cover (and the substrate) can be moveable.

The rinsing unit and/or the drying unit may be at least partially arranged in an opening of the treatment chamber so that the rinsing and/or drying effect can be applied by moving the substrate holder with the cover and the substrate through the opening in and/or out the treatment chamber. In other words, for rinsing and/or drying, the substrate holder with the cover and the substrate may be moved relative to the treatment chamber and in particular out of the treatment chamber and optionally again back into the treatment chamber. Preferably, the rinsing is accompanied by an out-and-in-movement relative to the treatment chamber. Preferably, the drying is accompanied by an out-movement relative to the treatment chamber.

For example after the rinsing and/or drying, the handling of the cover relative to the substrate holder by means of the rinsing unit may comprise a detachment of the cover from the substrate holder. The detachment of the cover from the substrate holder can be done inside the treatment chamber. The substrate holder with the cover (and the substrate) is either already in the treatment chamber or is moved into the treatment chamber. The movable rinsing unit may move from its retracted, parking or rinsing position towards the substrate holder in its extended position to detach the cover from the substrate holder, pick up the cover and move together with the cover back into its retracted position. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the rinsing unit from the retracted position into the extended position relative to the substrate holder, handling the cover in the treatment chamber from the substrate holder to the rinsing unit to detach the cover from the substrate holder, and moving the rinsing unit from the extended position into the retracted position relative to the substrate holder.

In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of extending the blind between the substrate holder and the rinsing unit after moving the rinsing unit from the extended position into the retracted position. This can be understood in that the blind is moved in-between the substrate holder and the detached cover now mounted on the rinsing unit to protect the cover and the rinsing unit from potential chemical or rinse fluid droplets and other potential contaminations like particles etc.

For example, after the cover is removed from the substrate holder, the substrate holder, its inner workings and the substrate can be rinsed and/or dried. As explained above, the rinsing and/or drying can be done by moving the substrate holder and the substrate relative to the rinsing unit and/or the drying unit. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the substrate holder out of the treatment chamber and back into the treatment chamber while rinsing the substrate holder, and moving the substrate holder out of the treatment chamber while drying the substrate holder.

For rinsing, e.g. a waterfall system as rinsing unit may provide a flowing rinsing fluid and the substrate holder (and the substrate) may be moved upwards through the waterfall to rinse the substrate holder, its inner workings (and the substrate) from any eventually leaked electrolyte or other chemistry. The rinsing may also comprises several in and out movements through the opening of the treatment chamber and therefore through the rinsing unit. After rinsing, the substrate holder (and the substrate) may move back into the treatment chamber.

For drying, e.g. an air knife as drying unit may provide a flowing drying medium through which the substrate holder (and the substrate) is moving upwards until the substrate holder (and the substrate) is out of the treatment chamber and dried from e.g. any rinsing fluid. The drying may also comprises several in and out movements through the opening of the treatment chamber and therefore through the drying unit. An additional drying-support step can take place e.g. by applying a drying supporting chemistry as e.g. iso-propyl alcohol in liquid form, as a vapor, vapor-spray, mist or the like. At the end of the drying step, the substrate holder (and the substrate) may be out of the treatment chamber.

For example after rinsing and/or drying the substrate holder (and the substrate), the substrate holder (and the substrate) may be inside the treatment chamber or can be moved back into the treatment chamber. The cover can be again attached to the substrate holder. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the rinsing unit from the retracted position into the extended position relative to the substrate holder, handling the cover in the treatment chamber from the rinsing unit to the substrate holder to attach the cover to the substrate holder, and moving the rinsing unit from the extended position into the retracted position relative to the substrate holder.

Details to moving the rinsing unit holding the cover and handling the cover from the rinsing unit to the substrate holder to attach the cover to the substrate holder can be found further above.

In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of extending the blind between the substrate holder and the rinsing unit after moving the rinsing unit from the extended position into the retracted position. Details to extending and retracting the blind can be found further above.

For example after the cover is again attached to the substrate holder, the cover as well as the substrate holder can be rinsed and/or dried and removed from the treatment chamber. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the steps of moving the substrate holder with the cover out of the treatment chamber and back into the treatment chamber while rinsing the substrate holder and the cover, and moving the substrate holder with the cover out of the treatment chamber while drying the substrate holder and the cover.

Details to rinsing and/or drying can be found further above.

The cover can be again detached from the substrate holder in the treatment chamber and the substrate holder can be removed from the treatment chamber. Otherwise, the substrate holder with the cover can be removed from the treatment chamber and the cover can be removed from the substrate holder outside the treatment chamber. Details to both options can be found further above.

After the cover is removed, the substrate can be removed from the substrate holder. In an embodiment, the method for a surface treatment of a substrate with a fluid therefore comprises the step of unloading the substrate from the substrate holder. The substrate may be removed from the substrate holder outside or inside the treatment chamber. In the first case, the substrate fixed to the substrate holder is removed from the treatment chamber and then the substrate is unloaded from the substrate holder. In the second case, the substrate is unloaded from the substrate holder and then the substrate separate from the substrate holder is removed from the treatment chamber.

The substrate may be moved outside the substrate holder and inside the treatment chamber by means of a handler, e.g. the second or Bernoulli handler. The substrate may then be transferred to the first, e.g. robotic, handler in the handoff position and be moved outside the treatment chamber by means of the first handler to a next processing operation or a storage location.

In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of removing the substrate from the treatment chamber. The substrate may be removed from the treatment chamber while being mounted to the substrate holder or when being already detached from and independent of the substrate holder. In the first case, the substrate fixed to the substrate holder is removed from the treatment chamber and then the substrate is unloaded from the substrate holder outside the treatment chamber. In the second case, the substrate is unloaded from the substrate holder in the treatment chamber and then the substrate separate from the substrate holder is removed from the treatment chamber.

In an embodiment, the method for a surface treatment of a substrate with a fluid further comprises the step of rinsing and/or drying the cover without the substrate holder being present. Also the rinsing unit can be rinsed and/or dried. These rinsings and/or dryings can be done before and/or after moving the substrate holder (and the substrate) out of the treatment chamber. It can be beneficial for the process quality that the rinsing unit and the cover residing inside the treatment chamber receive such intermediary rinsing and/or drying process.

It shall be understood that the system and the method according to the independent claims have similar and/or identical preferred embodiments, in particular, as defined in the dependent claims. It shall be understood further that a preferred embodiment of the application can also be any combination of the dependent claims with the respective independent claim.

These and other aspects of the present application will become apparent from and be elucidated with reference to the embodiments described hereinafter.

Brief description of the drawings

Exemplary embodiments of the application will be described in the following with reference to the accompanying drawing:

Figures la to li show schematically and exemplarily an embodiment of a system for a surface treatment of a substrate with a fluid according to the application, the sequence of Figures la to li further show different steps of an embodiment of a method for surface treatment of a substrate with a fluid according to the application.

Figures 2a to 2i show schematically and exemplarily another embodiment of a system for a surface treatment of a substrate with a fluid according to the application, the sequence of Figures 2a to 2i further show different steps of another embodiment of a method for surface treatment of a substrate with a fluid according to the application. Figures 3 a to 3 c show schematically and exemplarily details of the system for a surface treatment of a substrate with an anti-drop pin arranged at the substrate holder.

Figures 4a to 4c show schematically and exemplarily details of a roller blind of the system for a surface treatment of a substrate.

Figures 5a to 5b show schematically and exemplarily a modularity of a treatment chamber design.

Detailed description of embodiments

Figures la to li show schematically and exemplarily an embodiment of a system 10 for a surface treatment of a substrate 20 with a fluid according to the application. Figures la to li each show a cross section through the system 10 for a surface treatment at different stages of a surface treatment method.

The system 10 for a surface treatment of a substrate 20 comprises a substrate holder 1, a cover 2, and a treatment chamber 3. The substrate holder 1 is configured to hold the substrate 20 to be treated. The cover 2 is attachable to the substrate holder 1 and configured to cover 2 the substrate 20 at least partially. The treatment chamber 3 comprises a rinsing unit 4 to rinse the cover 2. The rinsing unit 4 is configured to handle the cover 2 relative to the substrate holder 1. The treatment chamber 3 further comprises a drying unit 5 to dry the cover 2.

An embodiment of a method according to the application for a surface treatment of a substrate 20 with a fluid is also shown by the sequence of Figures la to li. In Figure la, the substrate 20 was handled by handler (not shown), e.g. a robotic handler, from a loading station (not shown), e.g. a Front Opening Unified Pod or Front Opening Universal Pod (FOUP), to a loading station (not shown) to load the substrate 20 into or onto the substrate holder 1. The substrate 20 is here mounted to the substrate holder 1 by e.g. vacuum to form a substrate holder-substrate system. The cover 2 is not yet mounted to the substrate holder-substrate system. The substrate 20 mounted onto the substrate holder 1, but without the cover 2, is already loaded into the treatment chamber 3.

All additionally required parts for e.g. a dry contact substrate holder 1 to prepare the substrate 20 to be able to function mainly as a cathode in the electrolytic process, such as the cover 2, are placed and stored inside the treatment chamber 3. The assembly of the substrate holdersubstrate system with the cover 2, i.e. mounting the cover 2 to the substrate holder-substrate system to seal and protect the inner workings of the substrate holder- substrate system from the chemical process chemistries and to fix and seal e.g. electrical contacts is performed inside the treatment chamber 3.

To mount the cover 2 to the substrate holder-substrate system, the cover 2 is stored inside the treatment chamber 3 behind a roller blind 6. The cover 2 is held by the rinsing unit 4, e.g. by means of vacuum or a Bernoulli holder. The roller blind 6 can be made from a thin layer with a microstructure surface. The microstructure surface may turn a roller blind 6 surface into a hydrophobic or hydrophilic surface depending on its physical micro-structuring.

As shown in Figure lb, once the substrate holder- substrate system is in place inside the treatment chamber 3, the roller blind 6 is moved out of the way between the substrate 20 and the rinsing unit 4. The rinsing unit 4 is here a movable spray plate 4a holding the cover 2.

In Figure 1c, the movable spray plate 4a holding the cover 2 is moving towards the substrate holder- substrate system to load and connect the cover 2 to the substrate holder 1. The cover 2 may be mounted to the substrate holder 1, e.g. through vacuum, one or multiple magnetic fields, mechanical clamping, etc.

In Figure Id, after the cover 2 is mounted to the substrate holder 1, the spray plate 4a moves backward into a rinsing position. The rinsing may be a pre-wetting step, which can be understood as a rinsing of the substrate holder 1 and substrate 20 with a liquid (e.g. DI water). This may allow removing gas bubbles from the substrate surface and in particular from recesses or holes in the substrate surface.

After the pre-wetting, the substrate holder-substrate system with the cover 2 may be handled from the treatment chamber 3 into e.g. an electrolytic process chamber (not shown), where e.g. a metal deposition is performed. In addition or instead, the electrolytic process chamber may be another type of processing chamber, e.g. an acid, high-pH or solvent based chemical processing chamber for developing, removing or cleaning materials or contaminants from the substrate surface.

After the electrolytic plating process (or any other chemical processing) is finished, the substrate holder-substrate system with the cover 2 is moved back into the treatment chamber 3, as shown in Figure le, where it is rinsed from chemical residues e.g. by means of spraying a rinsing fluid onto the substrate 20 by means of the spray plate 4a and/or by means of supplying a rinsing fluid through a waterfall system (not shown). The assembly of the substrate holder-substrate system with the cover 2 enables an efficient rinsing and drying of all parts of the substrate holder- substrate system. Also, the inner workings of the substrate holder- substrate system can be efficiently rinsed from any eventually creeped-in electrolyte due to a failing seal, e.g. a lip seal.

As shown in Figure If, after the substrate holder- substrate system with the cover 2 has been rinsed thoroughly to remove all chemical residues, a drying step for the substrate holdersubstrate system and the cover 2 follows. The drying process is carried out by moving the substrate holder- substrate system with the cover 2 upwards through the drying unit 5, e.g. an air knife processing zone. An additional drying-support step can be applied by applying a drying supporting chemistry (not shown).

As shown in Figure 1g, after the drying step, the substrate holder-substrate system with the cover 2 moves back downwards into the treatment chamber 3. The movable spray plate 4a moves towards the substrate holder-substrate system to pick up the cover 2 and move back. The demounting of the cover 2 from the substrate holder-substrate system before another rinsing and drying is performed inside the treatment chamber 3.

Subsequently, as shown in Figures Ih and li, the roller blind 6 moves back between the substrate holder-substrate system and the cover 2 now mounted again on the spray plate 4a to protect the cover 2 and the spray plate 4a from potential chemical or rinse fluid droplets and other potential contaminations like particles etc. from the substrate holder- substrate system.

As a next step, not shown, the rinsing unit 4, e.g. the waterfall system, starts flowing rinsing fluid and the substrate holder- sub str ate system moves upwards through the waterfall flow out of the treatment chamber 3 to rinse the inner workings of the substrate holder-substrate system from any eventually leaked electrolyte or other chemistry. After the rinsing, the substrate holder-substrate system moves back into the treatment chamber 3 for another drying step.

The drying unit 5, e.g. the air knife, starts flowing a drying medium through which the substrate holder-substrate system moves upwards until the substrate holder- substrate system is completely out of the treatment chamber 3 and dried from any rinsing fluid. An additional drying-support step can be applied e.g. by applying a drying supporting chemistry.

After drying, the substrate holder- substrate system is moved to the loading station to unload the substrate 20 from the substrate holder 1 and into a FOUP or another handling system to move the substrate 20 to e.g. a next processing operation or a storage location.

In another embodiment, a fully mounted substrate holder-substrate system with cover 2 is assembled outside the treatment chamber 3 and as such loaded into the treatment chamber 3. The inner workings of the substrate holder- substrate system are then already protected by the cover 2. In this case, the above described sequence varies by not having to mount the cover 2 to the substrate holder- substrate system inside the treatment chamber 3. The other steps remain the same, i.e. the cover 2 is demounted within the treatment chamber 3 for rinsing and drying, mounted again after rinsing and drying, and moved out the treatment chamber 3 mounted to with the substrate holder- substrate system.

Figures 2a to 2i show schematically and exemplarily still another embodiment of a system 10 for a surface treatment of a substrate 20 with a fluid according to the application. Figures 2a to 2i each show a cross section through the system 10 for a surface treatment at different stages of a surface treatment method.

The system 10 for a surface treatment of a substrate 20 comprises a substrate holder 1, a cover 2, and a treatment chamber 3. The substrate holder 1 is configured to hold the substrate 20 to be treated. The cover 2 is attachable to the substrate holder 1 and configured to cover the substrate at least partially. The treatment chamber 3 comprises a rinsing unit 4 to rinse the cover 2. The rinsing unit 4 is configured to handle the cover 2 relative to the substrate holder 1. The treatment chamber 3 further comprises a drying unit 5 to dry the cover 2.

Another embodiment of a method according to the application for a surface treatment of a substrate 20 with a fluid is shown by the sequence of Figures 2a to 2i. The substrate 20 is handled by a motion unit 7 as e.g. a robotic handler from a loading station directly into the treatment chamber 3 without being mounted into or onto the substrate holder 1 and without the cover 2. All the required parts for loading the substrate 20 to the substrate holder 1 and preparing it to be able to function mainly as the cathode in e.g. an electrolytic process are placed and stored inside the treatment chamber 3. These parts may comprise the substrate holder 1, the cover 2, a Bernoulli handler 8, electrical contacts, etc.

The substrate holder 1 is permanently stored in the treatment chamber 3. The cover 2 is attached to the rinsing unit 4, here comprising at least one movable spray plate 4a, at least one movable waterfall system and at least one additional fixed spray plate 4b. The drying unit here comprises at least one moveable air knife and at least one fixed air knife. The moveable air knife and the movable waterfall system are in the beginning in a substrate loading position. The movements of the moveable air knife and the moveable waterfall system can be connected and/or coordinated with the movements of the movable spray plate 4a. At least one Bernoulli handler 8 is in the beginning located inside the treatment chamber 3 within an opening of the fixed spray plate 4b in a substrate loading position. In Figure 2a, the substrate 20 is moved directly and by using a motion unit 7, e.g. a robotic handling system (shown in Figure 2b), from a loading station (e.g. a FOUP) into the treatment chamber 3. The robotic handling system 7 can make use of a multi-axis handling or alternatively an indirect y-z axis handling technology. In particular in case of small substrates, also a manual or partial manual handling can be envisioned.

In Figure 2b, once the substrate 20 is at the correct position inside the treatment chamber 3, the robotic handling system 7 hands the substrate 20 over to a Bernoulli handler 8 in a handover position. Then, the robotic handling system 7 moves back out the treatment chamber 3.

In Figure 2c, the Bernoulli handler 8 with the substrate 20 attached to it moves the substrate 20 into or onto the substrate holder 1 to form a substrate holder-substrate system. The rinsing unit 4, here a movable spray plate 4a moves a cover 2 onto the substrate holder- substrate system. The substrate holder 1 together with the cover 2 clamps or fixes the substrate 20 through the application of vacuum, magnetic, mechanical, and/or other forces. After this step, the substrate holder-substrate system with the cover 2 is ready for any processing, e.g. chemical processing, while inner workings of the substrate holder-substrate system are protected from potential chemical or environmental attacks.

In Figure 2d, the Bernoulli handler 8 moves back into an opening within the fixed spray plate 4b. The movable spray plate 4a moves at about the same time into a process position and a pre-wetting step is carried out (not shown) in the treatment chamber 3, wherein at least one substrate surface is being pre-wetted with a pre-wetting liquid (e.g. DI water).

Then, the substrate holder- substrate system with the cover 2 is handled out of the treatment chamber 3 and into e.g. an electroplating chamber for e.g. a metal film to be deposited on the substrate 20 (not shown). The substrate holder-substrate system with the cover 2 can also be handled into another type of processing chamber e.g. an acid, high-pH or solvent based chemical processing chamber for developing, removing, or cleaning materials or contaminants from the substrate surface.

After the electrolytic plating process or any other chemical processing is finished and as shown in Figure 2e, the substrate holder- substrate system with the cover 2 is moved back into the treatment chamber 3, where it is rinsed (not shown) from chemical residues by means of the rinsing unit 4. The rinsing may be spraying a rinsing fluid onto the substrate 20 through the spray plate and/or supplying a rinsing fluid through the waterfall system. After the substrate holder-substrate system with the cover 2 is rinsed thoroughly to remove chemical residues, a drying process (not shown) to dry the cover 2 is carried out by moving the substrate holder- sub str ate system with the cover 2 upwards through a drying unit (not shown), here an air knife processing zone. An additional drying-support step can be applied e.g. by applying a drying supporting chemistry.

After the drying step for the cover 2 and as shown in Figure 2f, the substrate holder- substrate system with the cover 2 moves back downwards inside the treatment chamber 3 where the Bernoulli handler 8 is moving towards the substrate holder-substrate system with the cover 2 to secure the substrate 20 to the Bernoulli handler 8.

As shown in Figure 2g, the movable spray plate 4a moves towards the substrate holdersubstrate system with the cover 2 to pick up the cover 2 and moves together with the cover 2 back into a parking position.

As shown in Figure 2h, once the cover 2 is secured, the substrate 20 is moved by the Bernoulli handler 8 outside the substrate holder 1 into a handoff position of the substrate 20 to the robotic handling system 7.

As shown in Figure 2i, the robotic handling system 7 had picked up the substrate 20 from the Bernoulli handler 8 and moved the substrate 20 out of the treatment chamber 3 to the loading station and into e.g. a FOUP or another handling system to move the substrate 20 to a subsequent processing operation or a storage location.

Figures 3a to 3c show schematically and exemplarily details of the system 10 for a surface treatment of a substrate 20 with anti-drop pins 9. Figure 3a is a 3D view, Figure 3b is a crosssection and Figure 3c is a top view of a detail of the system 10 for a surface treatment. The anti-drop pins 9 are formed for holding the cover 2, the substrate holder 1 and/or the substrate 20 (not shown) together. The anti-drop pins 9 are therefore positioned at the rinsing unit 4 along a frame or edge of the cover 2 (see Figure 3c). The anti-drop pins 9 prevent the substrate 20 from getting damaged in case another holding system for the cover 2, the substrate holder 1 and/or the substrate 20 fails, as e.g. mechanic or magnetic forces fail. As shown in Figures 3a and 3b, a single anti-drop pin 9 comprises a cylindrical shaped pin body 9a extending through the rinsing unit 4, here the moveable spray plate 4a, and a suction surface 9b at a receiving surface of the rinsing unit 4 to contact and hold the cover 2, the substrate holder 1 and/or the substrate 20. The suction surface 9b is connected by means of a vacuum channel 9c extending through the pin body 9a to a pump 9d or source of reduced pressure or vacuum. The pump 9d or source of reduced pressure or vacuum can be controlled based on data from a sensor 9e detecting the presence of a cover 2, a substrate holder 1 and/or a substrate 20, e.g. a contact or pressure sensor. The suction surface 9b further comprises at least a protrusion to be inserted into a recess or hole of the cover 2 and/or the substrate holder 1. A free end of the protrusion comprises a barb disk to retain the cover 2, the substrate holder 1 and/or the substrate 20.

Figures 4a to 4c show schematically and exemplarily details of a blind 6 of the system 10 for a surface treatment of a substrate 20. Figure 4a is a 3D view, Figure 4b is a side view and Figure 4c is a 3D view of a detail of the system 10 for a surface treatment. As shown in Figures 4a and 4b, the blind 6 can be a compound of two foils, e.g. a PFTE foil and preferably a self-adhesive PFTE foil. The blind 6 comprises a first surface 61 directed towards the rinsing unit 4 and/or the cover 2 and a second surface 62 directed towards the substrate holder 1. Both surfaces can be hydrophobic or hydrophilic, which can be achieved by a specific microstructure of the surface.

As shown in Figures 4a and 4c, the blind 6 can be a roller blind with at least a roller 63, to which the blind 6 is rolled or wound. The blind 6 can comprise an (e.g. upper) actuator rod 6a, preferably extending to an outside of the treatment chamber 3. The actuator rod 6a may be connected to a drive unit for moving the blind 6 between the extended and the retracted position of the blind 6. The blind 6 can comprise a guiding rod 6b attached at another (e.g. lower) part of the blind 6 to ease the motion of the blind 6. As shown in Figure 4c, the blind 6 or the treatment chamber 3 can further comprise at least a shield element 6c arranged and configured to shield and protect the roller 63 and/or to collect liquid droplets, which could otherwise be transferred by the roller 63 to e.g. an outside of the cover 2 and/or the rinsing unit 4. The blind 6 may further comprise a dripping nose 6d, e.g. arranged at the actuator rod 6a and/or the guiding rod 6b to retain any liquids or droplets.

Figures 5a to 5b show schematically and exemplarily a modularity of a treatment chamber 3 design. Individual units provide a flexibility to use one treatment chamber 3 design for several applications by exchanging units, e.g. an automation unit 11, a rinsing unit 4, a roller blind 6 unit and/or a Bernoulli handler 8 unit.

It has to be noted that embodiments of the application are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

While the application has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The application is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed application, from a study of the drawings, the disclosure, and the dependent claims.

In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.