IN SPECTACLES

TECHNICAL FIELD AND BACKGROUND

The presently disclosed subject matter relates to methods and systems of delivering sound to a user.

In many applications, it is desired to provide a user with a high quality audio experience.

There is thus a need to provide new methods and systems for improving the audio experience provided to users.

GENERAL DESCRIPTION

In accordance with certain aspects of the presently disclosed subject matter, there is provided a system comprising spectacles, wherein the spectacles are equipped with at least one digital sound reconstruction speaker chip, a controller, an energy storage device, and conductors configured to connect said digital sound reconstruction speaker chip to said controller and said controller to said energy storage device, wherein the spectacles comprise at least one temple with at least one cavity, wherein the digital sound reconstruction speaker chip is located within said cavity, and wherein the controller is configured to control audio content produced by the digital sound reconstruction speaker chip, for supplying audio content to a user of the spectacles, said controlling comprising controlling at least directivity of sound waves produced by the digital sound reconstruction speaker chip.

In addition to the above features, the identification system according to this aspect of the presently disclosed subject matter can optionally comprise one or more of features (i) to (xiii) below, in any technically possible combination or permutation: i. the spectacles can be equipped with a driver (driver chip) that receives serial data from the controller and translates it into voltage signals that are fed into said digital sound reconstruction speaker chip;

ii. the driver can include DC to DC voltage circuits to create the voltages required for the operation of the digital sound reconstruction speaker chip; the spectacles are equipped with one or more conductors configured as antenna for at least one of wireless charging and wireless communication; the system comprises a first digital sound reconstniction speaker chip and a second digital sound reconstruction speaker chip, wherein the spectacles comprise a first temple and a second temple each comprising at least one cavity, wherein the first digital sound reconstruction speaker chip is located within said cavity of said first temple and the second digital sound reconstruction speaker chip is located within said cavity of said second temple; the system, comprises a first controiier configured to control at least directivity of the sound waves produced by the first digital sound reconstruction speaker chip, and a second controller configured to control at least directivity of the sound waves produced by the second digital sound reconstniction speaker chip, wherein the first controller and the second controller are operable to communicate data between them:

the controiier is configured to control the digital sound reconstruction speaker chip so that it produces sound waves which have a direction which is substantially oriented towards an ear of a user of the spectacles;

the controiier is configured to control the digital sound reconstniction speaker chip so that it produces sound waves which have a. direction which is substantially parallel to at least one temple of the spectacles;

the controller is configured to control the directivity of sound waves produced by the digital sound reconstniction speaker chip, said control comprising applying control signals with at least one different delay to pressure-pulse producing elements of the digital sound reconstruction speaker chip, wherein said at least one delay is stored in a storage device in communication with the controller, so as to obtain a predefined control of the directivity of the sound waves;

the spectacles are equipped with a plurality of distinct and adjacent digital sound reconstruction speaker chips, wherein the controller is configured to control at least the directivity of the sound waves produced by each of said digital sound reconstruction speaker chips;

the spectacles comprise at least one temple having a rear part located in the vicinity of an ear of a user of the spectacles, and the digital sound reconstruction speaker chip is attached to said rear part; xi. the system comprises a first digital sound reconstruction speaker chip and a second digital sound reconstruction speaker chip, wherein the spectacles comprise a first temple and a second temple each having a rear part located in the vicinity of an ear of a user of the spectacles, the first digital sound reconstruction speaker chip is attached to said rear part of said first temple, and the second digital sound reconstruction speaker chip is attached to said rear part of said second temple;

xii. the system comprises an acoustic window which is configured to cover the digital sound reconstruction speaker chip, wherein the acoustic window is configured to prevent passage of contaminating particles (e.g. larger than 30 nrn) while being sound -pressure wave transparent; and

xiii. said at least one temple comprises a hollow portion acting as a waveguide or comprising a waveguide, and an opening for delivering sound waves from this waveguide to the user of the spectacles, and the controller is configured to direct sound waves produced by the digital sound reconstruction speaker chip towards said wa veguide.

According to another aspect of the presently disclosed subject matter there is provided a system comprising spectacles, wherein the spectacles are equipped with a digital sound reconstruction speaker chip, a controller, an energy storage device, and conductors configured to connect said digital sound reconstruction speaker chip to said controller and said controller to said energy storage device, wherein the spectacles comprise at least one temple, said at least one temple comprising an inner waveguide and at least one opening, and wherein the controller is configured to control audio content produced by the digital sound reconstruction speaker chip, for supplying audio content to a user of the spectacles, said controlling comprising directing the sound waves towards the waveguide, for delivering audio content to said user through said at least one opening.

In addition to the above features, the system according to this aspect of the presently disclosed subject matter can optionally comprise one or more of the features (i) to (v), (vii) to (ix) and (xii) mentioned above, in any technically possible combination or permutation.

According to another aspect of the presently disclosed subject matter there is provided a system comprising spectacles comprising at least one temple having a rear part located in the vicinity of an ear of a user of the spectacles, wherein the spectacles are equipped with an energy storage device, a digital sound reconstruction chip connected to said rear part of said temple, a controller configured to control audio content produced by the digital sound reconstruction chip, for supplying said audio content to a user of the spectacles, and conductors configured to connect said digital sound reconstruction chip to said controller and said controller to said energy storage device.

in addition to the above features, the system according to this aspect of the presently disclosed subject matter can optionally comprise one or more of the features (i) to (iv), (xi) and (xii) mentioned above, in any technically possible combination or permutation.

According to another aspect of the presently disclosed subject matter there is provided a manufacturing method comprising providing spectacles comprising at least one temple, wherein said temple comprises one or more cavities, and inserting a controller, an energy storage device and at least one digital sound reconstruction speaker chip within said one or more cavities, wherein the controller is operable to control audio content produced by the digital sound reconstruction speaker chip, said controlling comprising controlling at least directivity of sound waves produced by the digital sound reconstruction speaker chip.

In addition to the above features, the spectacles can optionally be manufactured to comprise the features (i) to (xiii) mentioned above, in any technically possible combination or permutation.

In addition to the above features, the method according to this aspect of the presently disclosed subject matter can optionally comprise one or more of features (xiv) to (xvii) below, in any technically possible combination or permutation:

xiv. the method comprises connecting the controller, the digital sound reconstruction speaker chip and the energy storage device to a substrate to obtain at least one assembly, and securing said at least one assembly to said at least one or more cavities;

xv. the method comprises providing spectacles comprising at least one temple, wherein said temple comprises one or more cavities, wherein said one or more cavities comprise at least one substrate and conductors, and connecting the controller, the digital sound reconstraction speaker chip and the energy storage device to said substrate and to said conductors;

xvi. said one or more cavities act as said substrate; and xvii. the method, comprises comprising manufacturing said at least one temple so that it comprises an inner waveguide for guiding sound waves, and an opening for exiting sound waves.

According to some embodiments, an innovative way to embed an audio emitter within spectacles is proposed. In particular, the proposed solution copes with the limited space present in spectacles.

According to some embodiments, the solution proposes a high quality audio experience, in which sound emitted from spectacles is focused towards the user's ears.

According to some embodiments, the solution is energy efficient.

According to some embodiments, the solution requires less volume than other solutions.

According to some embodiments, the solution provides an efficient manufacturing method.

BRIEF DESCRIPTION OF THE DRAWING S

In order to understand the invention and to see how it can be carried out in practice, embodiments will be described, by way of non-limiting embodiments, with reference to the accompanying drawings, in which:

Fig. 1A illustrates an embodiment of a system comprising spectacles, wherein at least one temple of the spectacles comprises a plurality of cavities for hosting at least one digital sound reconstruction speaker chip and other components;

Fig. IB illustrates an embodiment of a system comprising spectacles, wherein at least one temple of the spectacles comprises a unified cavity for hosting at least one digital sound reconstruction speaker chip and other components;

Fig. 1C illustrates an embodiment of a system comprising spectacles, wherein a digital sound reconstruction speaker chip is located at a rear part of at least one temple of the spectacles;

Fig. ID illustrates an embodiment of a system comprising spectacles, wherein sound waves are directed through a hollow portion of the temple and exit from the temple via an opening; Fig. 2 illustrates a plurality of components which can be embedded in the spectacles;

Fsg. 3 illustrates principles for controlling directivity of sound waves produced by a digital sound reconstruction speaker chip of the spectacles;

- Fig. 4 illustrates a method of controlling directivity of sound waves produced by a digital sound reconstruction speaker chip of the spectacles;

Fig. 5 illustrates an embodiment of an electronic assembly comprising components described with reference to Fig. 2;

Fig. 6 illustrates an embodiment of a manufacturing method of the system; - Fig. 7 illustrates an embodiment of a manufacturing method in which an assembly is created and then inserted within a cavity of at least one temple; Fig. 8 illustrates an embodiment of a manufacturing method in which a cavity of at least one temple comprises a substrate and embedded conductors; and Fig. 9 illustrates an embodiment of a manufacturing method in which a cavity of at least one temple acts as a substrate and comprises embedded conductors.

Fig. 10 illustrates an embodiment of a manufacturing method in which the temple comprises a hollow portion for guiding sound waves and an opening for exiting sound waves. DETAILED DESCRIPTION

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the presently disclosed subject matter may be practiced without these specific details. In other instances, well-known methods have not been described in detail so as not to obscure the presently disclosed subject matter.

Unless specifically stated otherwise, as apparent from the following discussions, it is appreciated that throughout the specification discussions utilizing terms such as "controlling", "applying" or the like, refer to the action(s) and/or process(es) of a processing unit that manipulate and/or transform data into other data, said data represented as physical, such as electronic, quantities and/or said data representing the physical objects.

The term "processing unit" as disclosed herein should be broadly construed to include any kind of electronic device with data processing circuitry, which includes for example a computer processing device operativelv connected to a computer memory (e.g. digital signal processor (DSP), a microcontroller, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc.) capable of executing various data processing operations.

It can encompass a single processor or multiple processors, which may be located in the same geographical zone or may, at least partially, be located in different zones and may be able to communicate together.

The term "non-transitory memory" as used herein should be expansively construed to cover any volatile or non-volatile computer memory suitable to the presently disclosed subject matter.

Fig. 1A illustrates an embodiment of a system 100 comprising spectacles 101. It is to be understood that the representation of the spectacles 101 depicted in Fig. 1A is purely illustrative and other types, shapes or physical configurations can be used for the spectacles.

Spectacles 101 typically comprise two temples 102 (only one temple is illustrated in Fig. 1A) which are affixed to a frame 103 comprising glasses. Each temple comprises a front part 105, connected to the frame 103, and a rear part 106, whose extremity is free and which is close to the ears of the user wearing the spectacles.

The spectacles 101 are equipped with at least one digital sound reconstruction speaker chip 107 (MEMS), at least one energy storage device 108 and at least one controller 109 (components 107 to 109 are visible in Fig. 2).

The spectacles 101 can be equipped with additional components (as described in the various embodiments) such as at least one antenna 111 (or any other adapted component for receiving and'or emitting data), at least one communication component 110 (such as a wireless communication chip, which can handle the communication of data), a driver (such as driver 501 in Fig. 5), an acoustic window (as explained below), wireless charging component(s) (see e.g. reference 117 in Fig. 2, which can handle the wireless charging), and a microphone (see reference 119 in Fig. 2).

According to some embodiments, a single component is used for wireless communication and for wireless charging.

According to some embodiments, the controller, the communication component(s) and the wireless charging components) are embedded within a single chip. According to some embodiments the digital sound reconstruction speaker chip is mounted in its own package together with a driver chip, and covered by an acoustic window. They can be inserted into one of the cavities in the temple as a sub-assembly.

The components mentioned above can be secured/connected to the spectacles. As explained later in the specification, conductors are also provided to enable electrical connections between the components.

According to some embodiments, conductors can be shaped to be antennae (e.g. for wireless communication, wireless charging or both).

Embodiments describing possible implementations of these components will be described e.g. with reference to Figs. 2 and 5.

According to some embodiments, one or more cavities 115, 116 are provided in at least one of the temples of the spectacles. As explained later in the specification, the one or more cavities can comprise an opening which can be covered by an appropriate cover or acoustic window.

At least some of the components 107 to 110 can be embedded in these one or more cavities, as explained below. If a plurality of cavities are provided, they can be typically adjacent and separated by one or more walls. This is the case in Fig. 1A, in which a first cavity 115 and a second cavity 116 are present, separated by a wall 120.

The shape of the cavity can be chosen to fit to the shape of the substrate on which the components are mounted.

In some embodiments, some of the components can be fully integrated in the cavity. In other embodiments, part of the components can protrude, at least partially, from the cavity.

According to some embodiments, one or more cavities are located in the front part 105 of the temple, as illustrated in Fig. 1A (this is however not limitative and according to other embodiments, one or more cavities are located on other parts of the temple, such as the rear part of the temple).

According to some embodiments, the digital sound reconstruction speaker chip 107 is embedded in a cavity (such as cavity 115 in Fig. 1A).

According to some embodiments, the digital sound reconstruction speaker chip

107 is located in a first cavity of the temple, and at least some of the other electronic components (such as the controller and/or the energy storage device) are located in a second cavity of the temple. For example, in Fig. 1A, the digital sound reconstruction speaker chip 107 and its driver can be located in the first cavity 115, and the controller 109 and the energy storage device 108 can be located in the second cavity 116.

A hole can be present in the wail 120 separating the first cavity 115 from the second cavity 116, in order to allow passage of electric connections between the components present in the first cavity 115 and the components present in the second cavity 116.

According to some embodiments, the system 100 further comprises an acoustic window (not represented) covering the digital sound reconstruction speaker chip 107. The acoustic window is configured to prevent passage of contaminating particles (such as particles larger than 30 ran) while being sound-pressure wave transparent.

According to some embodiments, if several cavities are provided, the acoustic window covers at least the cavity (or the portion of the cavity) in which the digital sound reconstruction speaker chip 107 is located.

According to some embodiments, the system 100 further comprises a cover (not shown), wherein the part of the cover which surrounds the digital sound reconstruction speaker chip 107 is sound-pressure wave transparent (and thus corresponds to the acoustic window mentioned above), whereas the other parts of the cover do not need to be sound-pressure wave transparent.

According to some embodiments, the cover can be a single cover comprising different parts.

According to some embodiments, a plurality of different covers can be used. According to some embodiments, a first part of the cover covers the energy storage device, and this first part is removable to enable replacement of the energy storage device. A second part of the cover covers the other components (such as the digital sound reconstruction speaker chip, etc.). This second part can be either fixed or removable.

Attention is now drawn to Fig. IB.

According to some embodiments (see Fig. IB), at least one of the temples 102 comprises a single unified cavity 121. Although this cavity 121 is depicted in Fig. IB at the front part of the temple 102, it is to be noted that this cavity 121 can be located at other parts of the temple 102.

According to some embodiments, this unified cavity 121 can host a single substrate on which the components are mounted (as explained later with reference e.g. to Fig. 5), or a plurality of different substrates on which the components are mounted. Attention is now drawn to Fig. 1C.

In Fig. 1A, the digital sound reconstruction speaker chip 107 is located in a cavity 115 located in the front part 105 of the temple 102.

However, according to some embodiments, the digital sound reconstruction speaker chip 107 can be attached to the rear part 106 of the temple 102.

If the width of the rear part 106 of the temple 102 is large enough, at least one cavity can be provided in this rear part 106 to host the digital sound reconstruction speaker chip 107 as in Fig, 1A. This cavity can be a single cavity which hosts at least some of the other components of the system, (as in Fig. IB), or can be associated with one or more cavities which host at least some of the other components of the system (as in Fig. 1A). These embodiments are not represented in the figures.

According to other embodiments, a protrusion 125 can be provided at the rear part 106 of the temple 102 (see Fig. 1C).

The protrusion 125 can comprise one or more cavities 118 to host at least the digital sound reconstruction speaker chip 107. In some embodiments, the digital sound reconstruction speaker chip 107 is located within the cavity 118 of the protrusion 125, and the other elements 108 to 110 are located within one or more cavities (not represented) present in the temple 102.

As explained later in. the specification, according to some embodiments (such as in the embodiment of Fig. 1A), the directivity of the sound waves produced by the digital sound reconstruction speaker chip 107 can be controlled. If the digital sound reconstruction speaker chip 107 is located in the rear part 106 of the temple 102, that is to say in the vicinity of the ears of the user, it is not necessary to control directivity, since the position of the digital sound reconstruction speaker chip 107 already ensures that the sound waves are emitted towards the ears of the user.

Attention is now drawn to Fig. ID.

In the embodiment of Fig. ID, the temple 102 can comprise a hollow portion (the hollow portion is indicated as reference 130, but since it is located in the inner part of the temple, it is not visible in Fig, ID) which can. extend along the main direction of the temple 102.

This hollow portion 130 can act itself as a waveguide, in order to guide sound waves. In some embodiments, this hollow portion 130 can comprise a dedicated waveguide (that is to say a mechanical piece embedded within the hollow portion 130 and acting as a waveguide). The temple 102 can further comprise at least one opening 135, for allowing sound to exit from the waveguide and to reach the ears of the user. This opening 135 is typically located at a rear part of the temple 102, in particular in the vicinity of the ears of the user. This opening 135 can communicate with the waveguide, since sound waves need to exit the waveguide through the opening 135.

According to some embodiments, the controller 109 can control the sound waves produced by the digital sound reconstruction speaker chip 107 so that they are directed through the waveguide. Thus, the sound waves are emitted by the digital sound reconstruction speaker chip 107 towards the waveguide (in the rear direction, that is to say towards the user), go through the waveguide (as indicated by arrows 140), and then exit from the temple 102 via the opening 135, in order to reach the ears of the user.

In some embodiments, the temple 102 comprises one or more cavities (see cavity 121), wherein the cavity comprising the digital sound reconstruction speaker chip 107 communicates with the hollow portion 130. The cavity 121 can be in compliance with any of the embodiments described above.

The other components can be located within the cavity 121 or within the hollow portion 130.

In this case, it is not necessary that the digital sound reconstruction speaker chip

107 be covered with an acoustic window which allows transmission of sound, since sound waves are mainly transmitted within the hollow portion of the temple 102. This is however not mandatory.

In other embodiments, the temple 102 comprises only a. hollow portion and it is thus not necessary to provide an additional cavity. A first part of the hollow portion can host the digital sound reconstruction speaker chip 107 and the other components mentioned above, and a second part of the hollow portion can act as a waveguide or can comprise a dedicated waveguide.

Since spectacles comprise two temples, all the embodiments described above

(see e.g. Figs. 1A to ID) can be used for each of the temples, or for both of the temples.

Different embodiments can be applied to each of the temples.

In some embodiments, the spectacles are equipped with at least a first digital sound reconstruction speaker chip and a second digital sound reconstruction speaker chip.

The first digital sound reconstruction speaker chip can be located within a cavity of one of the temples and the second digital sound reconstruction speaker chip can be located within a cavity of the other temple. This cavity can be located in the front part of the temple, or in the rear part of the temple, or in a protrusion located at the rear part of the temple.

Different configurations can be used for the temples. For example, a first temple can have one or more cavities located at its front part to host the components, whereas a second temple can have one or more cavities located at its rear part to host the components.

According to some embodiments, the spectacles are equipped with a first controller and a second controller. The first controller can control the audio content produced by the first digital sound reconstruction speaker chip, and the second controller can control the audio content produced by the second digital sound reconstmction speaker chip.

If applicable, this control can comprise controlling directivity of the sound waves produced by each digital sound reconstruction speaker chip, as explained with reference to Fig. 3.

According to some embodiments, the first controller and the second controller are operable to communicate data between them. The exchanged data can be e.g. data for synclironizing the audio content produced by each of the digital sound reconstruction speaker chips, or other data pertaining to the production of sound, or pertaining to the control of other functions of the system. This communication can be ensured by using appropriate wiring between the two controllers, or by using wireless communication (such as by using a first antenna with a first communication component, and a second antenna with a second communication component, each of these communication components being able to communicate with one of the controllers).

In the embodiments in which at least two digital sound reconstruction speaker chips are embedded within the spectacles, a single energy storage device can be secured to the spectacles for providing energy to the components present in the two temples.

If necessary, at least two or more energy storage devices are provided in the spectacles, for example each one being located in one of the temples.

According to some embodiments, control switches (not represented) may be embedded in the spectacles, such as in at least one of the temples. The control switches can comprise e.g. "on / off switches and volume control switches. These examples are not limitative. The switches can comprise different kinds of sensors, such as mechanical sensors, electronic touch sensors, and/or optical sensors.

According to some embodiments, the spectacles (such as at least one of the temple) can include a sensor that can trigger production of the sound by the digital sound reconstruction speaker chip when a user puts on the spectacles.

Attention is now drawn to Fig. 2.

As mentioned above, sound can be produced by at least one digital sound reconstruction speaker chip 107. The digital sound reconstruction speaker chip 107 comprises an array of pressure-pulse producing elements. Each pressure -pulse producing element comprises at least a moving element, which can be constrained to move along at least an axis between electrodes, and can be latched at different time clocks in one of two extreme positions (a first extreme position is close to a first electrode, and a second extreme position is close to a second electrode) in response to a force such as an electrostatic force and/or a piezoelectric force.

Examples of such digital sound reconstruction speaker chips are described e.g. in WO 2011 /1 11042, WO 2009/066290 and WO 2012/070042 of the Applicants, which are hereby incorporated by reference in their entirety.

According to some embodiments, a plurality of adjacent and distinct digital sound reconstruction speaker chips 107 are secured to the spectacles. These different chips can be e.g. located in a row. This allows getting a longer emitting chip, which can be useful for controlling directivity of the sound waves (as explained below with reference to Fig. 3) at the required frequencies.

The controller 109, which is operable on a processing unit, can compute the signals which are to be applied to the array of moving elements in order to control their motion and thus produce a sound wave. These signals are typically voltages which are applied (through e.g. switching mechanisms) between the moving elements and the electrodes. In some embodiments, and as explained with reference to Fig. 5, a driver is provided to perform the switching, and DC to DC converters are provided to supply the digital sound reconstruction speaker chip with the different voltages required for its operation.

According to some embodiments, the controller 109 can communicate with a memory (not represented). The memory can be part of an ASIC on which the controller is implemented or can be an externa! memory with which the controller communicates. The controller 109 controls the audio content produced by the digital sound reconstruction speaker chip 107, so that the digital sound reconstruction speaker chip supplies this audio content to the user of the spectacles 107.

This control can comprise controlling e.g. properties of the sound produced by the digital sound reconstruction speaker chip, such as volume of the sound, spectral balance, etc.

This control can comprise also converting data representing digital audio (received e.g. via the antenna 111, or stored in a memory embedded in the spectacles) into a series of control signals to be applied to the digital sound reconstruction speaker chip 107. As explained with reference e.g. to Fig. 5, these control signals can be applied e.g. through a driver.

According to some embodiments, the control performed by the controller 109 comprises controlling at least directivity of sound waves produced by the digital sound reconstruction speaker chip. This can be used e.g. to orient and focus the sound waves produced by the digital sound reconstruction speaker chip 107 towards the ears of the user wearing the spectacles 101. Embodiments for controlling the directivity of sound waves will be described with reference to Fig, 3.

In order to provide energy to the system, the spectacles can be equipped with at least one energy storage device 108, which can include e.g. a battery or another power storage device. According to some embodiments, this system can include a rechargeable battery or a rechargeable power storage device. According to some embodiments, the energy storage device 108 can be charged remotely. A wireless charging component 117 (which can handle this wireless charging) can be thus embedded within the spectacles 101. For example, an RF, ultrasonic or optical power charging circuit can be embedded in the spectacles 101. Energy can be received through a photodiode (in the case of an optical power charging circuit), or through an ultrasonic transistor (in the case of an ultrasonic power charging circuit), or through an antenna (such as antenna 111, in the case of an RF power charging circuit). These examples are however not limitative.

The connection of the digital sound reconstruction speaker chip 107 to the controller 109 and the connection of the controller 109 to the energy storage device 108 can be made through electrical conductors (such as wires).

The spectacles 101 can further be equipped with a communication component 110, which comprises an electronic circuit handling the communication of data. As mentioned above, this component can be a standalone component or part of the controller.

This communication component 110 can communicate with the antenna 111. This communication component 110 can receive e.g. data representing the digital audio that has to be reconstructed by the digital sound reconstruction speaker chip 107. According to some embodiments, the communication component 110 can also handle the emission of wireless data through the antenna 111.

According to some embodiments, the spectacles 101 can further be equipped with at least one microphone 119. The microphone 119 can be embedded e.g. within a cavity present in one of the temples 102 of the spectacles 101, or in another portion of the spectacles, or can be affixed to the frame 103 or to one of the temples 102 of the spectacles.

in some embodiments, the microphone 119 is not secured to the spectacles 101 and is external to the spectacles. In this case, a two-way communication link (which can use e.g. the antenna 111 and the communication component 110) can be provided between the microphone 119 and the controller 109.

According to some embodiments, the user can provide voice commands through the microphone 119.

The voice commands can be converted by a processing unit (which can be embedded within the spectacles 101, and which can mn a dedicated function or metliod) into commands that are sent to the controller 109, using e.g. voice recognition algorithms.

Typical commands can include commands pertaining to a change of the volume, balance ears, etc. These examples are however not limitative.

According to some embodiments, audio content can be recorded by the user through the microphone 119 and can be transmitted through the antenna 111 to any other system which can exchange data with this antenna 111.

In addition, the user can listen to audio content (received e.g. through the antenna 111) reconstructed by the digital sound reconstruction speaker chip 107 under the control of the controller 101.

The system can thus be used e.g. as a portable communication device, such as a phone.

Attention is now drawn to Fie. 3. It has been mentioned that, according to some embodiments, the controller 109 can control directivity of sound waves produced by the digital sound reconstruction speaker chip 107.

Fig. 3 depicts principles which can be used to control directivity of the sound waves produced by the digital sound reconstruction speaker chip.

This control is also known as "beam steering". The "directivity" includes the pattern of the spatial distribution of the acoustic energy generated by the digital sound reconstruction speaker chip.

According to some embodiments, the shape of the beam is also controlled, in addition to the direction of the beam.

In Fig, 3, pressure-pulse producing elements 300 of a digital sound reconstruction speaker chip are depicted schematically as a row. This representation is not limitative, and a similar control applies to 2D arrays.

Since the pressure-pulse producing elements 300 have a size which is small compared to the wavelength, each pressure -pulse producing element creates a spherical wave-front.

If all the pressure-pulse producing elements 300 are activated together by the controller at each clock time, then the resulting sound beam will be omnidirectional. If the total size of the pressure -pulse producing elements 300 is large enough, the sound beam may have a forward preference.

In order to control the beam angle 302 , the controller can send control signals to the different pressure-pulse producing elements 300 with different delays.

In the example of Fig. 3 (see upper part of Fig. 3), the magnitude of the delays 301 applied to the pressure-pulse producing elements 300 increases linearly from the left to the right. This linear evolution is however not limitative.

The beam angle 302 of the beam wavefront 303 can thus be controlled by controlling the magnitude of these delays 301.

Control of the directivity of the sound is useful to ensure that sound is directed preferentially towards the ears of the user of the spectacles.

According to some embodiments, the delays (timing) which ensure an appropriate steering of the sound towards the user (or towards a waveguide present within the temple, as explained with reference to Fig. ID) are already pre-programmed and stored in a non-transitory memory in communication with the controller (such as in a memory embedded within the spectacles ). According to some embodiments, the delays are already embedded in the hardware of the system (ASIC).

An embodiment of a method of controlling audio content produced by the digital sound reconstruction speaker chip 107 is illustrated in Fig. 4,

The controller 109 can receive, e.g. through the communication component 110

(which can receive data through the antenna 111), data representing audio content to be pro vided to the user (step 400). The controller 109 can then control the actuation of the pressure-pulse producing elements of the digital sound reconstraction speaker chip 107 with adapted control signals (and adapted delays), for producing the corresponding audio content with an expected directivity (step 401).

According to some embodiments, the controller 109 controls the sound waves produced by the digital sound reconstraction speaker chip 107 so that the sound waves have a direction which is substantially oriented towards an ear of a user of the spectacles 101. If two digital sound reconstraction speaker chips are used, wherein each of the chips is secured to one of the temples, each of the chips can be controlled to produce sound towards the corresponding ear of the user.

According to some embodiments, the sound waves are controlled to have a direction which is substantially parallel to at least one of the temple (or to be substantially parallel to the temple, wherein the angle between the direction of sound waves and the temple is below a threshold).

In embodiments wherein the digital sound reconstruction speaker chip 107 is located in the front part 105 of the temple 102 (see e.g. Fig. 1A), control of the directivity of the sound can be useful to ensure that the sound waves propagate preferentially towards the ears of the user.

In embodiments wherein the digital sound reconstruction speaker chip 107 is located at the rear part 106 of the temple (see e.g. Fig. 1C), the position of the digital sound reconstruction speaker chip already ensures that the sound waves are preferentially directed towards the ears of the user. However, if necessary, control of the directivity of the sound can also be performed.

Attention is now drawn to Fig. 5.

Fig. 5 describes an assembly 500 comprising possible electronics that can be used for implementing and connecting the different components described above (with reference e.g. to Figs. 1 and 2). The assembly 500 can comprise at least one substrate 503 onto which the components are secured.

The substrate 503 can comprise at least one layer of conductors (not shown) used to enable electrical connections between the different components.

According to some embodiments, the assembly 500 can comprise one or more conductors (not represented) which are shaped to create an antenna for wireless communication, and, if applicable, for wireless charging, as already explained with reference to Fig. 2.

At least one digital sound reconstruction speaker chip 505 is mounted on the substrate 503. In the example of Fig. 6, it is mounted along the long axis of the substrate 503. Connections between the digital sound reconstruction speaker chip 505 and the substrate 503 may be made using wire bond, flip chip (this is not limitative) or similar methods known in the art.

The assembly 500 further comprises a controller 502.

The controller 502 can comprise one or more ASIC chips. As mentioned above, the controller 502 can control various functions of the system, such as conversion of digital audio and audio settings into control signals to be applied to the digital sound reconstruction speaker chip 505, directly or through a driver, such as driver ASIC 501. According to some embodiments, it can also control directivity of sound, power resources, and other functions of the system.

The assembly 500 further comprises an energy storage device 504. If the energy storage device 504 is configured to be charged wirelessly, an RF, ultrasonic or optical power charging circuit can be assembled on the substrate 503.

According to some embodiments, the digital sound reconstruction speaker chip 505 may be controlled using a passive matrix addressing method (a passive matrix addressing is described e.g. in WO 201 1/11 1042 of the Applicants). In this case, the assembly 500 can comprise a driver (ASIC) 501 that receives serial data from the controller 502 and converts them into voltages that drive the pressure-pulse producing elements arranged e.g. in rows and columns. The driver 501 can also contain test circuitry to test the elements (such as the moving elements of each pressure-pulse producing element) of the digital sound reconstruction speaker chip 505 and to provide test feedback to the controller 502, so that the controller 502 will not utilize the elements that were identified as faulty when running the audio control algorithm(s). The assembly 500, or the driver 501, can also comprise DC to DC converter circuits to produce different voltages (not represented) that may be required for the digital sound reconstruction speaker chip operation (in this case, discrete passive components, such as coils and capacitors, can be assembled on the substrate 503) .

In some embodiments, the driver 501 can be built to be rectangular, in some embodiments (see Fig. 5), the driver 501 has a length which is substantially equal to the length of the digital sound reconstruction speaker chip 505.

In this case, the columns of the array of the digital sound reconstruction speaker chip can be wire bonded directly to the digital sound reconstruction speaker chip 505, thus reducing conductor routing on the substrate 503.

If the digital sound reconstruction speaker chip 505 is addressed as an active matrix (an active matrix addressing is described e.g. in WO 2011/111042 of the Applicants), the digital sound reconstruction speaker chip 505 itself can contain the drive electronics and the driver 501 is not needed.

As mentioned above, an acoustic window (not shown) can be mounted over the digital sound reconstruction speaker chip 505 to protect it from contaminating particles.

According to some embodiments, the one or more cavities in which the components are located (see e.g. cavities 115, 116, 118 and 121 in Figs. 1A to 1C) can comprise dedicated and embedded conductors to allow connections of the substrate(s) holding the components to the cavity.

In some embodiments, the one or more cavities in which the components are located (see e.g. cavities 115, 116, 118 and 121 in Figs. 1A to IC) can comprise dedicated and embedded conductors and also act themselves as substrates.

In this case, the components can be connected to the cavity and can be connected between them using the embedded conductors present in the cavity.

This applies both to the case where a single cavity is used, or in cases where a plurality of cavities are used.

Attention is now drawn to Fig. 6 which describes a manufacturing method of the system.

The method can comprise providing spectacles comprising temples, wherein at least one of said temples comprises one or more cavities (step 600). The cavities can be made after the temple has been manufactured. Position of the cavities can be in compliance with any of the embodiments described above. The method can comprise inserting (step 601) at least one controller, at least one energy storage device and at least one digital sound reconstruction speaker chip within said one or more cavities. These components are in compliance with any of the embodiments described above. In particular, the controller can be configured to control at least the directivity of the sound waves produced by the digital sound reconstruction speaker chip.

If other components are used (such as a communication component, a microphone, etc.), these components can be inserted as well into the one or more cavities.

The method can comprise covering the components with one or more covers

(such as an acoustic window), as described above.

In some embodiments (see Fig, 7), the controller, the energy storage device and the digital sound reconstruction speaker chip are first mounted on one or more substrates. Appropriate connections can be made between the components, using conductors of the substrate (e.g. wires). At least one assembly is obtained (step 700 in

Fig. 7).

The assembly can comprise additional components as already mentioned in the various embodiments above.

The completed assembly can then be secured to the cavity (step 701), using any adapted mechanical fastening method (e.g. adhesives, pressure fitting, fasteners, etc.). Alternatively, the assembly is inserted into the cavity, and a cover is fastened to the cavity in order to maintain the assembly within the cavity. In some embodiments, the cover (such as the acoustic cover) is a part of said assembly.

In some embodiments (see Fig. 8), the temple is manufactured so that the one or more cavities comprise at least one substrate and conductors (step 800). In other words, the substrate and the conductors are embedded in advance within the cavity.

In this case, the controller, the energy storage device and the digital sound reconstruction speaker chip (and if applicable, the other components) are mounted (step 801) on the substrate present in the cavity and connected to the conductors (for enabling connection to the substrate and appropriate connections between the components).

In some embodiments (see Fig. 9), the temple is manufactured so that the cavity acts as a substrate and conductors are embedded within the cavity (step 900). In this case, the controller, the energy storage device and the digital sound reconstruction speaker chip are mounted (step 901) on the cavity and connected to the conductors (for enabling connection to the cavity acting as substrate and connections between the components).

In some embodiments, and as described with reference to Fig, 1C, a protrusion 125 can be present in the rear part of the temple, for hosting e.g. the digital sound reconstruction speaker chip.

According to some embodiments, this protrusion can be built as part of the temple during the manufacturing of the temple (such as by moulding).

In some embodiments (see Fig. 10), the temple can be manufactured so that it comprises an inner hollow portion and an opening for exiting sound waves (step 1000). The opening can be located at the rear part of the temple, that is to say e.g. near the ears of the user.

As explained above with reference to Fig. ID, the hollow portion can act as a waveguide for sound waves. According to some embodiments, a dedicated waveguide is provided within said hollow portion. It can be e.g. inserted during manufacturing.

In some embodiments, the temple is manufactured so as to comprise one or more cavities, which can communicate with the hollow portion. The components can be inserted within the one or more cavities, in accordance with any of the embodiments described with reference to Figs. 6 to 9.

In other embodiments, the temple is manufactured so as to comprise an inner hollow portion, and the components are inserted during manufacturing within the hollow portion. A part of the hollow portion can thus host the components, and another part of the hollow portion can act as a waveguide or can comprise a dedicated waveguide.

The components can then be embedded within the spectacles 101 (see step 1001 in Fig. 10).

The embodiments described above for the cavity (see Figs. 7 to 9) can be used to insert the components within the hollow portion.

In particular, an assembly can be created and inserted within the hollow portion

(similarly to the method described with reference to Fig. 7), or a part of the hollow portion can comprise a substrate and conductors to which the components are connected (similarly to the method described with reference to Fig. 8), or a part of the hollow portion can act itself as a substoite (similarly to the method described with reference to

Fig. 9).

It is to be noted that the various features described in the various embodiments may be combined according to all possible technical combinations. It is to be understood that the invention is not limited in its application to the details set forth in the description contained herein or illustrated in the drawings. The invention is capable of other embodiments and of being practiced and carried out in various ways. Hence, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting. As such, those skilled in the art will appreciate that the conception upon which this disclosure is based may readily be utilized as a basis for designing other structures, methods, and systems for carrying out the several purposes of the presently disclosed subject matter.

Those skilled in the art will readily appreciate that various modifications and changes can be applied to the embodiments of the invention as hereinbefore described without departing from its scope, defined in and by the appended claims.