Title:
TABLE OF WAFER POLISHER, METHOD OF POLISHING WAFER, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2000/076723
Kind Code:
A1
Abstract:
A table for a wafer polisher is capable of resisting heat, thermal shocks and abrasion and suited to larger semiconductor wafers of high quality. A table (2) includes a plurality of laminates (11) consisting of silicide-base ceramic or carbide-base ceramic. The laminates (11) are united using a bonding layer (14). Fluid channels (12) are provided in the interface between the laminates (11).
Inventors:
OKUDA YUJI (JP)
JIMBO NAOYUKI (JP)
MAJIMA KAZUTAKA (JP)
TSUJI MASAHIRO (JP)
TAKAGI HIDEKI (JP)
ISHIKAWA SHIGEHARU (JP)
YASUDA HIROYUKI (JP)
JIMBO NAOYUKI (JP)
MAJIMA KAZUTAKA (JP)
TSUJI MASAHIRO (JP)
TAKAGI HIDEKI (JP)
ISHIKAWA SHIGEHARU (JP)
YASUDA HIROYUKI (JP)
Application Number:
PCT/JP2000/003899
Publication Date:
December 21, 2000
Filing Date:
June 15, 2000
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
OKUDA YUJI (JP)
JIMBO NAOYUKI (JP)
MAJIMA KAZUTAKA (JP)
TSUJI MASAHIRO (JP)
TAKAGI HIDEKI (JP)
ISHIKAWA SHIGEHARU (JP)
YASUDA HIROYUKI (JP)
OKUDA YUJI (JP)
JIMBO NAOYUKI (JP)
MAJIMA KAZUTAKA (JP)
TSUJI MASAHIRO (JP)
TAKAGI HIDEKI (JP)
ISHIKAWA SHIGEHARU (JP)
YASUDA HIROYUKI (JP)
International Classes:
B24B1/00; B24B37/015; B24B37/12; B24B37/14; B24B37/16; B24B41/047; B24B49/14; (IPC1-7): B24B37/00; B24B37/04
Foreign References:
| JPH1190814A | 1999-04-06 | |||
| EP0860238A2 | 1998-08-26 | |||
| JPH09150351A | 1997-06-10 | |||
| JPH1190814A | 1999-04-06 |
Other References:
See also references of EP 1238755A4
Attorney, Agent or Firm:
Onda, Hironori (Ohmiya-cho 2-chome Gifu-shi Gifu, JP)
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