Title:
TAPE ADHESION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/180943
Kind Code:
A1
Abstract:
[Problem] To provide a tape adhesion system capable of automatically carrying out switching and replacing of a dicing tape. [Solution] A tape adhesion system 1 comprising: a stocker 5 that stores a plurality of tape magazines 4 which each accommodate a dicing tape DT wound into a roll; an adhesion device 3 that is provided with movable guide rollers 32a, 32b which restrict a reel-out region R of the dicing tape DT to a prescribed track, fixed guide rollers 33a, 33b, and a knife plate 35, and adheres the dicing tape DT to a dicing frame DF and a workpiece W in a manner that allows replacement of the tape magazines 4; and a first conveyance robot 6 that passes the tape magazines 4 back and forth between the stocker 5 and the adhesion device 3.
Inventors:
KIZAKI KIYOTAKA (JP)
KANAZAWA MASAKI (JP)
AOKI HITOSHI (JP)
KANAZAWA MASAKI (JP)
AOKI HITOSHI (JP)
Application Number:
PCT/JP2021/041647
Publication Date:
September 01, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
B65H19/12; H01L21/301; H01L21/683
Foreign References:
| JP2016008104A | 2016-01-18 | |||
| JP2006143351A | 2006-06-08 |
Attorney, Agent or Firm:
SHIMIZU Takamitsu (JP)
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