Title:
TAPE FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2018/105613
Kind Code:
A1
Abstract:
A tape for semiconductor processing, which is used for the purpose of dividing an adhesive layer along a semiconductor chip by means of expansion, and which sequentially comprises a substrate film, a gluing agent layer and an adhesive layer in this order. This tape for semiconductor processing is configured such that: the substrate film has a stress at 5% elongation of 5 MPa or more in both MD and TD, a tensile strength at 5% elongation of 10-30 N/25 mm in both MD and TD, and a thickness of 70-150 μm; and the adhesive layer has a thickness of 40 μm or more and a storage elastic modulus at 25°C of 2,000 MPa or less.
Inventors:
YOKOI HIROTOKI (JP)
MATSUBARA YUKIHIRO (JP)
MATSUBARA YUKIHIRO (JP)
Application Number:
PCT/JP2017/043649
Publication Date:
June 14, 2018
Filing Date:
December 05, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; B23K26/53; B32B7/10; B32B27/00; C09J7/20; C09J201/00; H01L21/304
Domestic Patent References:
| WO2012043340A1 | 2012-04-05 | |||
| WO2014080918A1 | 2014-05-30 | |||
| WO2011004825A1 | 2011-01-13 |
Foreign References:
| JP2009242586A | 2009-10-22 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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