Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TAPE
Document Type and Number:
WIPO Patent Application WO/2022/230907
Kind Code:
A1
Abstract:
This tape (10) comprises a substrate layer (12) and a pressure-sensitive adhesive layer (11) disposed on one surface thereof, and has an elongation at break of 100% or higher and a modulus of 2 GPa or less. The tape (10) has, after having been heated at 230°C for 80 seconds, an elongation at break of 100% or higher and a modulus of 2 GPa or less.

Inventors:
SUZUKI YUNA (JP)
TSUKUDA SOUICHI (JP)
CHISHIMA KENJI (JP)
Application Number:
PCT/JP2022/018955
Publication Date:
November 03, 2022
Filing Date:
April 26, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09J7/20; C09J201/00; H01L21/301; C09J7/25
Foreign References:
JP2017126735A2017-07-20
JP2011068727A2011-04-07
JP2006339236A2006-12-14
JP2014001363A2014-01-09
JP2021068877A2021-04-30
JP2021076510A2021-05-20
JP2003105292A2003-04-09
JP2010225753A2010-10-07
JP2010251722A2010-11-04
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: NEURAL NETWORK GENERATION DEVICE, NEURAL NETWORK COMPUTING DEVICE, EDGE DEVICE, NEURAL NETWORK CONTR...

Next Patent: COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ADHESIVE LAYER, NONAQUEOUS SECONDARY BATTERY ADHESIVE L...