TARGET TRANSFER STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND FIXING METHOD FOR LIGHT EMITTING DIODE

WIPO Patent Application WO/2021/119997

A1

A target transfer structure and a manufacturing method, and a fixing method for a light emitting diode. A target transfer structure (99) comprises: a target substrate (40), multiple pairs of substrate electrodes (10) which are provided at intervals being provided on the target substrate (40); multiple light emitting diodes (20), each light emitting diode (20) being provided with one pair of semiconductor electrodes (200); and a photosensitive adhesive layer (30) coated on the target substrate (40), multiple through holes (300) being provided on the photosensitive adhesive layer (30), the substrate electrodes (10) and the semiconductor electrodes (200) being inserted in the through holes, and the semiconductor electrodes (200) being provided opposite to corresponding substrate electrodes (10). A target transfer structure having a buffering function is manufactured by coating the photosensitive adhesive layer on the target substrate, so as to alleviate the pressure when the light emitting diodes are transferred to the target substrate, and avoid damage to the light emitting diodes or the target substrate.

ZHANG PENGYUE (CN)
HUANG JIAHUA (CN)
CHEN SHUZHI (CN)
CHEN POFU (CN)
ZHENG SHISONG (CN)

PCT/CN2019/125952

June 24, 2021

December 17, 2019

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CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)

H01L33/02; H01L33/00; H01L33/12

WO2012120807A1

2012-09-13

CN105990475A	2016-10-05
CN110071177A	2019-07-30
CN105206727A	2015-12-30
CN106783554A	2017-05-31
CN109935664A	2019-06-25
US20120175636A1	2012-07-12

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