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Patent Searching and Data


Title:
TECHNIQUES AND APPARATUSES FOR RATE SPLITTING USING FIRST LAYERS AND SECOND LAYERS
Document Type and Number:
WIPO Patent Application WO/2019/200602
Kind Code:
A1
Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a transmitter device may split data associated with a user equipment (UE), of two or more different UEs, into at least one of a first part, a second part, or a combination thereof; multiplex the first part of the data associated with the UE with a first part of data associated with one or more other UEs, of the two or more different UEs, to form multiplexed data; map the multiplexed data to a first set of layers; and map the second part of the data associated with the UE and a second part of data associated with the one or more other UEs to a second set of layers. Numerous other aspects are provided.

Inventors:
HAO CHENXI (US)
ZHANG YU (US)
WEI CHAO (US)
WU LIANGMING (US)
LI QIAOYU (US)
XU HAO (US)
Application Number:
PCT/CN2018/083886
Publication Date:
October 24, 2019
Filing Date:
April 20, 2018
Export Citation:
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Assignee:
QUALCOMM INC (US)
HAO CHENXI (CN)
ZHANG YU (CN)
WEI CHAO (CN)
WU LIANGMING (CN)
LI QIAOYU (CN)
XU HAO (CN)
International Classes:
H04W72/12
Foreign References:
EP3291628A12018-03-07
CN107529202A2017-12-29
Other References:
QUALCOMM INCORPORATED: "On RLC split for inter-site multi-point transmission in HSDPA", 3GPP TSG RAN WG2 MEETING #76, R2-116059, 18 November 2011 (2011-11-18), XP050564416
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LIMITED (CN)
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