Title:
TEMPERATURE ADJUSTMENT MOLD, TEMPERATURE ADJUSTMENT METHOD, AND RESIN CONTAINER MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157863
Kind Code:
A1
Abstract:
This temperature adjustment mold for adjusting the temperature of a bottomed injection-molded resin preform is provided with: a first mold which contains the preform inside and is in contact with the outer circumferential surface of the preform; a second mold which is inserted into the preform and is in close contact with the neck section of the preform; and a third mold which is inserted into the preform integrally with the second mold and receives the bottom section of the preform at a mold surface thereof. The third mold has an opening through which compressed air is introduced into the preform. The gap from the mold surface of the third mold to the first mold when the third mold has been inserted into the preform is greater than the thickness of the preform.
Inventors:
KOMIYAMA TOMOKAZU (JP)
NAGASAKI ATSUSHI (JP)
NAGASAKI ATSUSHI (JP)
Application Number:
PCT/JP2023/005157
Publication Date:
August 24, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
NISSEI ASB MACHINE CO LTD (JP)
International Classes:
B29C49/64; B29B11/08; B29C49/06; B29C49/18; B29C49/48
Domestic Patent References:
| WO2020138292A1 | 2020-07-02 |
Foreign References:
| JPH04119819A | 1992-04-21 | |||
| JPS59230725A | 1984-12-25 | |||
| JPS5920628A | 1984-02-02 | |||
| JP2016528066A | 2016-09-15 | |||
| JPH0462028A | 1992-02-27 | |||
| JPS6378727A | 1988-04-08 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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