Title:
TEMPERATURE CHANGE CALCULATION METHOD FOR THREE-DIMENSIONAL STACKED MEMORY CHIP
Document Type and Number:
WIPO Patent Application WO/2022/041198
Kind Code:
A1
Abstract:
Disclosed in the present invention is a temperature change calculation method for a three-dimensional stacked memory chip. The method comprises: combining a heat transfer theory with the structure of a three-dimensional stacked memory chip; constructing a three-dimensional physical model according to physical structure parameters of the memory chip; uniformly selecting surrounding nodes for each node in the three-dimensional physical model; establishing a heat conduction differential equation on the basis of performance parameters of the memory chip and the ambient temperature; solving the equation to obtain temperature information of each node at the next moment and taking the temperature information as a program simulation temperature, and periodically starting a temperature measurement apparatus, such as a temperature sensor/a thermal camera; and obtaining accurate temperature information of the memory chip to correct the program simulation temperature. More accurate temperature information is obtained, and the working time of the temperature measurement apparatus during chip operation is also greatly reduced, the power consumption of the whole memory system and the bandwidth occupation of the memory chip are both reduced, and the service life of temperature measurement apparatus is also prolonged.
Inventors:
WANG YI (CN)
WANG XIANHUA (CN)
LIAO HAO (CN)
ZHOU CHI (CN)
MAO RUI (CN)
WANG XIANHUA (CN)
LIAO HAO (CN)
ZHOU CHI (CN)
MAO RUI (CN)
Application Number:
PCT/CN2020/112484
Publication Date:
March 03, 2022
Filing Date:
August 31, 2020
Export Citation:
Assignee:
UNIV SHENZHEN (CN)
International Classes:
G11C29/50
Foreign References:
| CN103714189A | 2014-04-09 | |||
| CN105784138A | 2016-07-20 | |||
| CN106919723A | 2017-07-04 | |||
| CN111415003A | 2020-07-14 | |||
| US20170372916A1 | 2017-12-28 | |||
| US20200212106A1 | 2020-07-02 |
Attorney, Agent or Firm:
SUNSHINE INTELLECTUAL PROPERTY INTERNATIONAL CO., LTD. (CN)
Download PDF: