Title:
TEMPERATURE COMPENSATION DEVICE AND THERMAL OVERLOAD RELAY INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/050525
Kind Code:
A1
Abstract:
A temperature compensation device and a thermal overload relay including same are disclosed. A temperature compensation device according to one embodiment of the present invention includes compensation bimetal coupled to a compensation link. The compensation bimetal extends along the compensation link from outside of the compensation link so as to be formed to have increasing length and curved length. Therefore, the extension length of the compensation bimetal increases according to changes in peripheral temperature, so that the operational reliability of the temperature compensation device and the thermal overload relay can be enhanced.
Inventors:
LEE KYUNGKU (KR)
Application Number:
PCT/KR2021/002811
Publication Date:
March 10, 2022
Filing Date:
March 08, 2021
Export Citation:
Assignee:
LS ELECTRIC CO LTD (KR)
International Classes:
H01H71/16; H01H71/10; H01H71/12
Foreign References:
| KR20100003779U | 2010-04-08 | |||
| KR200225118Y1 | 2001-05-15 | |||
| KR200411527Y1 | 2006-03-15 | |||
| KR20130096081A | 2013-08-29 | |||
| JP3093323U | 2003-05-09 |
Attorney, Agent or Firm:
PARK, Jang-Won (KR)
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