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Patent Searching and Data


Title:
TEMPERATURE CONTROL DEVICE AND TEMPERATURE CONTROL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/067471
Kind Code:
A1
Abstract:
Provided in the embodiments of the present disclosure are a temperature control device and a temperature control system, which belong to the field of chip inspection. The temperature control device comprises an object table, a housing and at least one temperature control structure. The object table is used for bearing a chip; the housing is provided with a first air inlet and a first air outlet; the object table is arranged inside the housing; and the housing is used for reducing heat transfer between a chip on the object table and the external environment. The temperature control structure is provided with a main body portion and a temperature control assembly, wherein an air output channel is defined by the main body portion; the main body portion is provided with a second air inlet and a second air outlet; the second air outlet is connected to the first air inlet; external air enters, from the second air inlet, the air channel defined by the main body portion and then enters, from the second air outlet, a heat preservation housing; and the temperature control assembly is connected to the main body portion to control the temperature of air in the air channel.

Inventors:
HOU MENGJUN (CN)
MA XIANGGUO (CN)
LIU ZONGMIN (CN)
WANG YOUXUE (CN)
Application Number:
PCT/CN2020/118717
Publication Date:
April 07, 2022
Filing Date:
September 29, 2020
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
G05D23/30; G01R31/28
Foreign References:
CN208488689U2019-02-12
CN203928154U2014-11-05
CN202904406U2013-04-24
CN102109559A2011-06-29
CN104251871A2014-12-31
CN208985023U2019-06-14
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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