Title:
TEMPERATURE CONTROL MODULE
Document Type and Number:
WIPO Patent Application WO/2023/136155
Kind Code:
A1
Abstract:
Provided is a temperature control module having high cooling ability and a thin profile, the temperature control module comprising a Peltier element and a vapor chamber layered on the Peltier element, the total thickness of the Peltier element and the vapor chamber being 1 mm or less.
Inventors:
KIDA SATOSHI (JP)
SHINODA TOMONORI (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
KATO KUNIHISA (JP)
SHINODA TOMONORI (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
KATO KUNIHISA (JP)
Application Number:
PCT/JP2022/048456
Publication Date:
July 20, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H10N10/13; F25B21/02; H10N10/852; H10N10/857
Domestic Patent References:
| WO2021241635A1 | 2021-12-02 | |||
| WO2022084884A1 | 2022-04-28 |
Foreign References:
| US20160181504A1 | 2016-06-23 | |||
| JP2019050239A | 2019-03-28 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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