Title:
TEMPERATURE DISTRIBUTION EVALUATION METHOD, TEMPERATURE DISTRIBUTION EVALUATION DEVICE, AND SOAKING RANGE EVALUATION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/218484
Kind Code:
A1
Abstract:
To provide a new temperature distribution evaluation method, a temperature distribution evaluation device, and a soaking range evaluation method, as the temperature distribution evaluation method which evaluates a temperature distribution of a heating area 40A provided in a heating device 40, the present invention is a temperature distribution evaluation method which, in the heating area 40A, heats a semiconductor substrate 10 and a transmitting and receiving body 20 for transporting a raw material to and from the semiconductor substrate 10, and evaluates a temperature distribution of the heating area 40A on the basis of a substrate thickness variation amount A of the semiconductor substrate 10. Accordingly, temperature distribution evaluation can be implemented for a high temperature area at 1600 - 2200°C or the like at which it is hard to evaluate the temperature distribution due to the limit of a thermocouple material.
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Inventors:
KANEKO TADAAKI (JP)
DOJIMA DAICHI (JP)
ASHIDA KOJI (JP)
IHARA TOMOYA (JP)
DOJIMA DAICHI (JP)
ASHIDA KOJI (JP)
IHARA TOMOYA (JP)
Application Number:
PCT/JP2020/017644
Publication Date:
October 29, 2020
Filing Date:
April 24, 2020
Export Citation:
Assignee:
KWANSEI GAKUIN EDUCATIONAL FOUND (JP)
TOYOTA TSUSHO CORP (JP)
TOYOTA TSUSHO CORP (JP)
International Classes:
G01K3/14; G01K13/12; H01L21/66
Foreign References:
| JP2002203850A | 2002-07-19 | |||
| JP2002261140A | 2002-09-13 | |||
| JP2008066643A | 2008-03-21 | |||
| JP2009111295A | 2009-05-21 | |||
| JP2016008821A | 2016-01-18 |
Attorney, Agent or Firm:
TSUJITA, Tomoko (JP)
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