Title:
TEMPERATURE-MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/002324
Kind Code:
A1
Abstract:
A temperature-management system provided with the following: a thermally insulated outer container (2); a thermally conductive inner container (3) that contains a drug under test or other object such that same can be placed into and removed from the outer container; one or more first upper and lower heat-storage materials (4a, 4b); and one or more second upper and lower heat-storage materials (5a, 5b). The first and second lower heat-storage materials (4a, 5a) are placed in surface contact with each other, the second lower heat-storage materials (5a) are arranged inside the outer container towards the bottom thereof, the inner container is placed on top of the first lower heat-storage material (4a) inside the outer container, the first and second upper heat-storage materials (4b, 5b) are placed in surface contact with each other, and the first upper heat-storage material (4b) is disposed so as to contact the top of the inner container. The first upper and lower heat-storage materials (4a, 4b) are thus cooled by the second upper and lower heat-storage materials (5a, 5b) and the resulting heat of fusion from the first upper and lower heat-storage materials is conducted to the interior of the inner container, thereby maintaining the interior of the inner container at a prescribed temperature and consequently maintaining the contents thereof at a prescribed temperature.
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Inventors:
FUJII KENSUKE (JP)
Application Number:
PCT/JP2012/066527
Publication Date:
January 03, 2013
Filing Date:
June 28, 2012
Export Citation:
Assignee:
SUGIYAMA GEN CO LTD (JP)
FUJII KENSUKE (JP)
FUJII KENSUKE (JP)
International Classes:
B65D81/18; A61J3/00
Domestic Patent References:
| WO2010055295A1 | 2010-05-20 |
Foreign References:
| US6482332B1 | 2002-11-19 | |||
| JP2007191209A | 2007-08-02 |
Attorney, Agent or Firm:
TOKYO-ARPA IP & CO. (JP)
Patent business corporation Tokyo Alpa patent firm (JP)
Patent business corporation Tokyo Alpa patent firm (JP)
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Claims:
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