Title:
TEMPERATURE REGULATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199702
Kind Code:
A1
Abstract:
A refrigeration cycle (12) includes a compressor (13), a refrigerant radiator (14, 42) for causing heat to dissipate from a refrigerant flowing out from the compressor, and a first expansion valve (16) for reducing the pressure of the refrigerant that has flowed out from the refrigerant radiator. Further, the refrigeration cycle includes: a first evaporator (17) for allowing the refrigerant that has flowed out from the first expansion valve to evaporate and then flow to the compressor; a second expansion valve (20) for reducing the pressure of the refrigerant that has flowed out from the refrigerant radiator; and a second evaporator (21) for allowing the refrigerant that has flowed out from the second expansion valve to evaporate and then flow to the compressor. A heat medium circuit (30) includes a heat exchanging unit (32, 33), and a heat medium circulates in the heat medium circuit while passing through the heat exchanging unit and the second evaporator. The first evaporator causes heat to be exchanged between blown air (Af) and the refrigerant, thereby causing the refrigerant to evaporate and cooling the blown air, and the second evaporator causes heat to be exchanged between the heat medium and the refrigerant, thereby causing the refrigerant to evaporate and cooling the heat medium. The heat exchanging unit cools a temperature regulation target by means of the heat medium.
Inventors:
NOGUCHI KOHEI (JP)
YOKOO YASUHIRO (JP)
KATO YOSHIKI (JP)
IJUIN YUKIHISA (JP)
KAWANO HIROAKI (JP)
HAYASHI YOSHIO (JP)
HIRAYAMA JUNKI (JP)
MUTO NAITO (JP)
YOKOO YASUHIRO (JP)
KATO YOSHIKI (JP)
IJUIN YUKIHISA (JP)
KAWANO HIROAKI (JP)
HAYASHI YOSHIO (JP)
HIRAYAMA JUNKI (JP)
MUTO NAITO (JP)
Application Number:
PCT/JP2023/010909
Publication Date:
October 19, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F25B5/02; B60H1/22; B60H1/32; F25B1/00; F25B29/00
Domestic Patent References:
| WO2021131437A1 | 2021-07-01 | |||
| WO2017038677A1 | 2017-03-09 |
Foreign References:
| JP2020165604A | 2020-10-08 | |||
| JP2002067661A | 2002-03-08 | |||
| JP2001206039A | 2001-07-31 | |||
| JPH1026459A | 1998-01-27 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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