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Patent Searching and Data


Title:
TEMPERATURE REGULATING SYSTEM AND TEMPERATURE REGULATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/016962
Kind Code:
A1
Abstract:
A temperature regulating system and a temperature regulating method, aiming at precisely regulating the temperature of a specific position of a wafer. The temperature regulating system comprises: a bearing platform, comprising a central stage (103) and a plurality of edge stages (102), the plurality of edge stages (102) being arranged around the central stage (103); a plurality of temperature regulating modules (106), each temperature regulating module (106) being connected to one edge stage (102), and each temperature regulating module (106) being used for regulating the temperature of the corresponding wafer region on the corresponding edge stage (102); a parameter obtaining module, used for obtaining the temperature of the wafer on the bearing platform; and a processing module, obtaining an abnormal temperature region of the wafer and adjusting the temperature of the temperature regulating module (106) corresponding to the abnormal temperature region. The parameter obtaining module obtains the temperature of the wafer on the bearing platform to obtain the abnormal temperature region of the wafer; then, the processing module obtains the corresponding temperature regulating module (106) on the basis of the position of the abnormal temperature region.

Inventors:
YU XIANYONG (CN)
Application Number:
PCT/CN2021/092910
Publication Date:
January 27, 2022
Filing Date:
May 10, 2021
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G03F7/20; G05D23/00; H01L21/00; H01L21/683
Foreign References:
CN101410190A2009-04-15
CN105047543A2015-11-11
CN108803260A2018-11-13
CN102541119A2012-07-04
CN110600419A2019-12-20
US20150338747A12015-11-26
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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