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Patent Searching and Data


Title:
TEMPERATURE-SENSITIVE MICRONEEDLE PATCH AND METHOD FOR FABRICATING SAME
Document Type and Number:
WIPO Patent Application WO/2019/050121
Kind Code:
A1
Abstract:
The present invention relates to: a microneedle patch comprising at least one microneedle, and a plurality of temperature-sensitive discoloration materials having mutually different discoloration temperatures; a kit comprising the microneedle patch; and a method for fabricating the microneedle patch.

Inventors:
LEE JEONG GUN (KR)
CHO SHIN HEE (KR)
SHIN BO YOUNG (KR)
Application Number:
PCT/KR2018/004016
Publication Date:
March 14, 2019
Filing Date:
April 05, 2018
Export Citation:
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Assignee:
S SKIN CO LTD (KR)
International Classes:
A61M37/00; A61K9/00; C09D5/26
Foreign References:
KR20130136216A2013-12-12
KR101549086B12015-09-02
US20080145428A12008-06-19
KR20170000745A2017-01-03
KR20160056004A2016-05-19
KR20170015763A2017-02-09
Attorney, Agent or Firm:
MAPS INTELLECTUAL PROPERTY LAW FIRM (KR)
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