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Title:
TEMPERATURE SENSOR AND TEMPERATURE SENSOR ARRAY
Document Type and Number:
WIPO Patent Application WO/2021/199647
Kind Code:
A1
Abstract:
Provided is a temperature sensor that offers excellent load-bearing capacity and high temperature detection accuracy. This temperature sensor comprises a flexible substrate and a sensor unit formed on the flexible substrate. The flexible substrate includes: a first portion that is located at an edge of the flexible substrate and that has the sensor unit formed thereon; and a second portion that is adjacent to the first portion in a direction away from the edge and that has a maximum thickness between a first surface and a second surface thereof that are opposite to each other. A surface of the first portion opposite to the sensor unit and the first surface of the second portion are on the same plane. At least the first surface of the second portion forms a sensing surface that makes contact with an object for temperature detection. The total thickness of the first portion and the sensor unit is less than the maximum thickness of the second portion.

Inventors:
FUNAHASHI SHUICHI (JP)
IDE HIROAKI (JP)
FUKUTANI TATSUYA (JP)
AOKI NORIHISA (JP)
TSUNODA MASAKAZU (JP)
Application Number:
PCT/JP2021/003499
Publication Date:
October 07, 2021
Filing Date:
February 01, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01K7/22
Domestic Patent References:
WO2012093572A12012-07-12
WO2019009320A12019-01-10
Foreign References:
JP2019074326A2019-05-16
US20130182745A12013-07-18
JP2015129731A2015-07-16
JP2016090262A2016-05-23
JP2020064343A2020-04-23
Other References:
See also references of EP 4089381A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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