TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING, AND LAMINATE MANUFACTURING METHOD

Title:

TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING, AND LAMINATE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/006311

Kind Code:

A1

Abstract:

This temporary adhesive material for substrate processing, which is for adhering a substrate to be processed on the back surface temporarily on a support, and is characterized in that, per 100 parts by total mass, the temporary adhesive material contains 10-100 parts by mass of a siloxane bond-containing polymer which has a 3,000-700,000 weight-average molecular weight measured by GPC, the temporary adhesive material has a first temporary adhesive material layer and a second temporary adhesive material layer different from the first temporary adhesive material layer, and, within the range 130-250°C, the minimum shear viscosity of at least one of the first temporary adhesive material layer and the second temporary adhesive material layer is 1-10,000 Pa*s. In this way, temporary adhesion and separation of the substrate and support body are easy, the temporary adhesive material layer forming process is rapid, and it is possible to obtain excellent dimensional stability and heat process resistance and to increase productivity of thin substrates. A laminate manufacturing method that uses this temporary adhesive material is also provided.

Inventors:

TANABE MASAHITO (JP)
SUGO MICHIHIRO (JP)
YASUDA HIROYUKI (JP)

Application Number:

PCT/JP2020/026818

Publication Date:

January 14, 2021

Filing Date:

July 09, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHINETSU CHEMICAL CO (JP)

International Classes:

C09J11/04; C09J7/30; C09J183/04; H01L21/304; H01L21/683

Domestic Patent References:

WO2017191815A1

2017-11-09

Foreign References:

JP2016072612A	2016-05-09
JP2017013311A	2017-01-19
JP2018203880A	2018-12-27
JP2004064040A	2004-02-26
JPS6059631B2	1985-12-26

Other References: