Title:
TEMPORARY ADHESIVE FOR PRODUCING SEMICONDUCTOR DEVICE, ADHESIVE SUPPORT INCLUDING SAME, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/157306
Kind Code:
A1
Abstract:
A temporary adhesive for producing a semiconductor device is provided with which it is possible to diminish even at high temperatures the problem wherein, when a member to be treated (e.g., a semiconductor wafer) is mechanically or chemically treated while being temporarily supported by a temporary adhesive, the temporary adhesive evolves a gas and it is also possible to easily remove the temporary support of the treated member without damaging the treated member, even after high-temperature processing. The temporary adhesive for producing a semiconductor device comprises (A) a radical-polymerizable monomer having a functionality of 2 or less, (B) a radical-polymerizable monomer having a functionality of 3 or greater, (C) a polymer, and (D) a free-radical polymerization initiator.
Inventors:
IWAI YU (JP)
KOYAMA ICHIRO (JP)
FUJIMAKI KAZUHIRO (JP)
KOYAMA ICHIRO (JP)
FUJIMAKI KAZUHIRO (JP)
Application Number:
PCT/JP2014/058458
Publication Date:
October 02, 2014
Filing Date:
March 26, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J4/00; C09J4/02; C09J11/06; C09J171/02; H01L21/02; H01L21/304
Foreign References:
| JP2004119780A | 2004-04-15 | |||
| JP2012241069A | 2012-12-10 | |||
| JP2005023188A | 2005-01-27 | |||
| JP2004253612A | 2004-09-09 | |||
| JP2012057141A | 2012-03-22 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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