Title:
TERAHERTZ MODULE
Document Type and Number:
WIPO Patent Application WO/2022/019136
Kind Code:
A1
Abstract:
This terahertz module comprises: a terahertz chip (10) including an active element that emits terahertz waves; and a dielectric substrate (50) connected to the terahertz chip (10). The terahertz chip (10) includes a semiconductor substrate (1). An active element (20) is disposed on the upper surface of the semiconductor substrate (1). Of a plurality of side surfaces of the dielectric substrate (50), a first side surface (SP) has a part in which a cut section (CS) is formed from the upper side to the lower side of the first side surface (SP). The terahertz chip (10) is fitted in such an orientation that the upper surface of the semiconductor substrate (1) is parallel to the first side surface (SP), and the semiconductor substrate (1) is disposed on the inner side of the cut section (CS).
Inventors:
FUJITA MASAYUKI (JP)
HEADLAND DANIEL JONATHAN (JP)
NAGATSUMA TADAO (JP)
NISHIDA YOSUKE (JP)
HEADLAND DANIEL JONATHAN (JP)
NAGATSUMA TADAO (JP)
NISHIDA YOSUKE (JP)
Application Number:
PCT/JP2021/025773
Publication Date:
January 27, 2022
Filing Date:
July 08, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
H01P1/203; H03B7/08
Foreign References:
| JP2015187716A | 2015-10-29 | |||
| US20050191774A1 | 2005-09-01 | |||
| JP2014197837A | 2014-10-16 | |||
| US20190044211A1 | 2019-02-07 | |||
| US20110169405A1 | 2011-07-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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