Title:
TERMINAL COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/235473
Kind Code:
A1
Abstract:
A terminal cooling device (1) for cooling a power supply terminal (3) as an object to be cooled is provided with a heat transfer member (31) and a cooling unit (11). The heat transfer member (31) is disposed across a plurality of power supply terminals (3), and is deformable in a direction (TLO) intersecting a direction (TL) in which the plurality of power supply terminals (3) are arranged. The cooling unit (11) is directly or indirectly connected to a surface in a plate thickness direction of the heat transfer member (31), and supplies cold heat to the power supply terminals (3) via the heat transfer member (31).
Inventors:
OMI YASUMITSU (JP)
MIURA KOJI (JP)
MIURA KOJI (JP)
Application Number:
PCT/JP2018/019167
Publication Date:
December 27, 2018
Filing Date:
May 17, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H05K7/20; F28D15/02; H01L23/473; H01M10/613; H01M10/625; H01M10/653; H01M10/6552; H01M50/209; H01M50/50
Foreign References:
| JP2003163036A | 2003-06-06 | |||
| US20110305935A1 | 2011-12-15 | |||
| US20130280574A1 | 2013-10-24 | |||
| US20150221998A1 | 2015-08-06 | |||
| JP2005071674A | 2005-03-17 | |||
| JP2010113961A | 2010-05-20 | |||
| JP2012216360A | 2012-11-08 | |||
| JP2016091800A | 2016-05-23 | |||
| JP5942943B2 | 2016-06-29 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
Download PDF: