TERMINAL, TERMINAL-EQUIPPED WIRE, AND METHOD FOR MANUFACTURING TERMINAL

Title:

TERMINAL, TERMINAL-EQUIPPED WIRE, AND METHOD FOR MANUFACTURING TERMINAL

Document Type and Number:

WIPO Patent Application WO/2022/196676

Kind Code:

A1

Abstract:

Provided is a terminal comprising a terminal-shaped parent material configured from copper or a copper alloy, a nickel layer disposed on at least part of the surface of the parent material, an IMC layer disposed directly on at least part of the nickel layer, and an indium layer disposed directly on the IMC layer, the IMC layer being configured from an intermetallic compound that contains nickel and indium, and the average thickness of the IMC layer being 0.13 μm or greater.

Inventors:

WATANABE HAJIME (JP)
KAWADA DAISUKE (JP)

Application Number:

PCT/JP2022/011541

Publication Date:

September 22, 2022

Filing Date:

March 15, 2022

Export Citation:

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Assignee:

AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

International Classes:

C23C24/08; H01R13/03; H01R43/16

Foreign References:

JP2012028139A	2012-02-09
JPS53103938A	1978-09-09
JP2009076473A	2009-04-09
JP2015137417A	2015-07-30

Attorney, Agent or Firm:

YAMANO Hiroshi et al. (JP)

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