Title:
TEST PATTERN AND METHOD FOR EVALUATING PATTERN
Document Type and Number:
WIPO Patent Application WO/2023/047533
Kind Code:
A1
Abstract:
This test pattern T is for testing the processing state of a mesa 202 used as a real element M. The real element M includes the mesa 202, which is formed by etching a substrate 200, and an electrode 201 formed on the mesa 202. The test pattern T includes a mesa 204 formed by etching the substrate 200, and a thin film 203 that is formed at least on an upper surface 204a of the test pattern T and is thinner than the electrode 201. The state of etching of the mesa 202 is evaluated on the basis of the difference between the shape of the test pattern T and the shape of the thin film 203. As a result of this configuration, the lateral etching amount during etching is evaluated quantitatively and accurately, even though the testing is non-destructive.
Inventors:
NADA MASAHIRO (JP)
TATSUMI SHOKO (JP)
NAKANISHI YASUHIKO (JP)
TATSUMI SHOKO (JP)
NAKANISHI YASUHIKO (JP)
Application Number:
PCT/JP2021/035090
Publication Date:
March 30, 2023
Filing Date:
September 24, 2021
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01L21/3065; H01L21/306
Foreign References:
JP2016018981A | 2016-02-01 | |||
JPS63117428A | 1988-05-21 | |||
JPH04150025A | 1992-05-22 | |||
JPH031529A | 1991-01-08 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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