TETRA(METH)ACRYLATE COMPOUND, CURING COMPOSITION CONTAINING SAME, AND CURED PRODUCTS OF THOSE

WIPO Patent Application WO/2005/044777

A1

A (meth)acrylate compound represented by the formula (1) below and a curing composition containing such a (meth)acrylate compound can be used in various applications such as resist inks, coating materials and molding materials. A curing composition which contains, in addition to the tetra(meth)acrylate compound (B), an alkali-soluble carboxyl group-containing compound (A), a polymerization initiator (C), a diluent solvent (D), a compound (E) having two or more cyclic ethers in a molecule, a curing catalyst (F) and the like is useful for solder resists for printed circuit boards, etching resists, plating resists, interlayer insulating layers for multilayer wiring boards, permanent masks used in production of tape carrier packages, resists for color filters and the like. (In the formula, R¹, R², R³ and R⁴ respectively represent a hydrogen atom or a methyl group; and X represents a dicarboxylic acid residue, preferably represents an aliphatic dicarboxylic acid residue or aromatic dicarboxylic acid residue.)

KOHIYAMA NOBORU (JP)

PCT/JP2004/016419

May 19, 2005

November 05, 2004

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TAIYO INK MFG CO LTD (JP)
KOHIYAMA NOBORU (JP)

C07C69/54; C07C69/76; C07C69/82; C07C69/83; C08F22/10; H05K1/00; H05K3/28; (IPC1-7): C07C69/83; C07C69/54; C08F20/20

JPH0586307A	1993-04-06
JPS5177324A	1976-07-05
SU960174A1	1982-09-23
SU876617A1	1981-10-30

BERLIN A.A.: "POlymer-oligomer compositions and their starting materials", PLASTE UND KAUTSCHUK, vol. 20, no. 10, 1973, pages 728 - 737, XP002985001

Yoshida, Shigeki (Harada Bldg. 14-2, Takadanobaba 2-chom, Shinjuku-ku Tokyo 75, JP)

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