Title:
THERMAL BARRIER COATING AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/186094
Kind Code:
A1
Abstract:
The present invention relates to the technical field of coatings, and provides a thermal barrier coating and a preparation method therefor. The thermal barrier coating provided in the present invention is of a double-layer structure, and comprises an intermediate layer attached to a surface of a metal bonding layer and a top layer; the intermediate layer is formed by atmospheric plasma spray of YSZ porous microspheres, and the top layer is formed by atmospheric plasma spray of Yb-Gd co-doped YSZ porous microspheres; the intermediate layer is in contact with the surface of the metal bonding layer, and the top layer is directly exposed to a high-temperature gas environment. The thermal barrier coating provided in the present invention has low thermal conductivity, excellent sintering resistance, and long service life.
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Inventors:
ZHANG XIANCHENG (CN)
ZHAO XIAOFENG (CN)
YU YALI (CN)
TU SHANTUNG (CN)
ZHANG DINGWU (CN)
WANG XIAOBO (CN)
SHI JUNMIAO (CN)
WANG WEIZE (CN)
ZHAO XIAOFENG (CN)
YU YALI (CN)
TU SHANTUNG (CN)
ZHANG DINGWU (CN)
WANG XIAOBO (CN)
SHI JUNMIAO (CN)
WANG WEIZE (CN)
Application Number:
PCT/CN2023/085478
Publication Date:
October 05, 2023
Filing Date:
March 31, 2023
Export Citation:
Assignee:
UNIV EAST CHINA SCIENCE & TECH (CN)
UNIV SHANGHAI JIAOTONG (CN)
CHINA UNITED GAS TURBINE TECH CO LTD (CN)
UNIV SHANGHAI JIAOTONG (CN)
CHINA UNITED GAS TURBINE TECH CO LTD (CN)
International Classes:
B22F1/054; C23C4/11; B22F1/065; B22F3/11; B22F9/02; C23C4/134
Foreign References:
| CN114574798A | 2022-06-03 | |||
| CN113388801A | 2021-09-14 | |||
| CN109161837A | 2019-01-08 | |||
| CN106588042A | 2017-04-26 | |||
| CN113930705A | 2022-01-14 | |||
| US20150233256A1 | 2015-08-20 |
Other References:
ZHOU SHUILIANG; SHEN SHAOBO; CHEN YUANYUAN; ZHANG ZHEN; WU SUJUN: "Fast synthesis of novel micron porous particles of Gd, Yb and Y-stabilized zirconia to prepare TBCs with low thermal conductivity", MATERIALS CHEMISTRY AND PHYSICS, ELSEVIER SA, SWITZERLAND, TAIWAN, REPUBLIC OF CHINA, vol. 259, 9 November 2020 (2020-11-09), Switzerland, Taiwan, Republic of China , XP086473977, ISSN: 0254-0584, DOI: 10.1016/j.matchemphys.2020.124018
Attorney, Agent or Firm:
BEIJING FINELAND IP FIRM (CN)
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