Title:
Thermal conductive potting composition
Document Type and Number:
WIPO Patent Application WO/2020/087196
Kind Code:
A1
Abstract:
This invention relates to a thermal conductive potting composition. In particular, the present invention relates to a thermal conductive potting composition having a low viscosity, a high thermal conductivity, a high toughness and excellent thermal shock performance for new energy vehicles.
Inventors:
LEI HUANG (CN)
WU HAO (CN)
QIU XUEYU (CN)
XIE XUE (CN)
WU HAO (CN)
QIU XUEYU (CN)
XIE XUE (CN)
Application Number:
PCT/CN2018/112319
Publication Date:
May 07, 2020
Filing Date:
October 29, 2018
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C08L63/00; C08K3/22; C08L51/04; C09K5/14
Foreign References:
| CN106753143A | 2017-05-31 | |||
| EP1887033A1 | 2008-02-13 |
Other References:
See also references of EP 3873986A4
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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