Title:
THERMAL-DEPENDENT ADHESIVE FOR ELECTRONIC AND ELECTRICAL MATERIAL, ADHESIVE TAPE STRUCTURE AND PREPARATION PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/134862
Kind Code:
A1
Abstract:
Disclosed is a thermal-dependent adhesive for electronic and electrical material, comprising an acrylic acid copolymer resin. The weight percentage of the formulation of the acrylic acid copolymer resin comprises 33-41% of butyl acrylate, 31-37% of hydroxyethyl acrylate, 2-6% of ethyl acetate, 18-32% of artificial fiber rosin ester, and 1-3% of plastic hardener and elastic fiber. In the present invention, the formulation of the adhesive increases the peeling force of the reusable adhesive tape, improves the repeated use capability of the adhesive tape, and increases the service life of the bonding interface.
Inventors:
JEON HONGRYEOL (CN)
Application Number:
PCT/CN2019/122004
Publication Date:
July 02, 2020
Filing Date:
November 29, 2019
Export Citation:
Assignee:
SUZHOU HI TECH ELECTRONICS CO LTD (CN)
International Classes:
C09J4/02; C09J4/06; C09J7/30; C09J11/08
Foreign References:
| CN109777306A | 2019-05-21 | |||
| CN104152077A | 2014-11-19 | |||
| CN103242750A | 2013-08-14 | |||
| EP1144532A1 | 2001-10-17 |
Attorney, Agent or Firm:
SUZHOU HUABO INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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