Title:
THERMAL FLUID ANALYSIS METHOD, THERMAL FLUID ANALYSIS DEVICE, CONVERSION METHOD, CONVERTING DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2020/085351
Kind Code:
A1
Abstract:
This thermal fluid analysis method includes: using a physical model (11) to calculate airflow amounts of air blown out from each of a plurality of blow out holes (140) (step S11); setting at least one virtual blow out hole corresponding to a mesh in a two-dimensional model (21) of a cooled space (200) (step S12); allocating each of the plurality of blow out holes (140) in such a way that at least one blow out hole among the plurality of blow out holes (140) is allocated to one virtual blow out hole, for each of the at least one virtual blow out holes (step S13); calculating an equivalent airflow amount of the air blown out from each of the at least one virtual blow out holes, on the basis of the airflow amount of air blown out from each of the plurality of blow out holes (140) (step S14); and setting a physical quantity relating to each equivalent airflow amount as an analysis parameter in the two-dimensional model (21) (step S15).
Inventors:
HORIO HIDEAKI
YOSHIDA HIROKO
EGAMI NORIHIKO
YOSHIDA HIROKO
EGAMI NORIHIKO
Application Number:
PCT/JP2019/041429
Publication Date:
April 30, 2020
Filing Date:
October 23, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
F24F11/30; F24F11/49
Foreign References:
| JPH10326359A | 1998-12-08 | |||
| JP2007323510A | 2007-12-13 |
Other References:
NAKAJIMA, MASATO ET AL.: "Simulation Technologies for Product Development", FUJI ELECTRIC JOURNAL, vol. 89, 30 March 2016 (2016-03-30), pages 50 - 53, ISSN: 2187-1817
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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