Title:
THERMAL INFRARED IMAGING MECHANISM AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/086968
Kind Code:
A1
Abstract:
Provided in the present application are a thermal infrared imaging mechanism and an electronic device. The thermal infrared imaging mechanism comprises a substrate, a photosensitive unit and a diffractive optical element array, wherein a first vacuum chamber is provided above the substrate, the photosensitive unit is arranged in the first vacuum chamber, and the diffractive optical element array is arranged in the first vacuum chamber and is located on the side of the photosensitive unit which is used for receiving light. In the present application, a diffractive optical element array has functions such as focusing and imaging, such that when an incident angle of light is relatively large, light irradiated on an edge of a photosensitive area can be focused, by means of the diffractive optical element array, on a photosensitive element in the photosensitive area that is close to the edge, such that the amount of incoming light is increased, the angle of field of view of a thermal infrared camera is expanded, the signal-to-noise ratio of an output thermal infrared image can also be higher, the temperature measurement accuracy is higher, the temperature resolution is higher, and the temperature measurement range is wider.
Inventors:
ZHANG YOUMING (CN)
REN HUI (CN)
CUI XINSEN (CN)
REN HUI (CN)
CUI XINSEN (CN)
Application Number:
PCT/CN2022/126981
Publication Date:
May 02, 2024
Filing Date:
October 24, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G01N21/31
Foreign References:
| CN101458209A | 2009-06-17 | |||
| CN1474162A | 2004-02-11 | |||
| CN108051083A | 2018-05-18 | |||
| CN109830491A | 2019-05-31 | |||
| CN113990888A | 2022-01-28 | |||
| US20210342565A1 | 2021-11-04 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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