Title:
THERMAL INTERFACE MATERIAL, INTERFACE THERMAL COUPLING METHOD, AND PRODUCTION METHOD FOR THERMAL INTERFACE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/143190
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an interface thermal coupling method that ensures low thermal resistance and high thermostability using a graphite film and is capable of solving problems involved in conventional polymer/inorganic composite-type thermal interface materials; and a thermal interface material. In the interface method according to the present invention, a thermal interface material is sandwiched between two members for transferring heat therebetween, and has a graphite film, wherein the graphite film has a thickness T of 200 nm to 3 μm, and the ratio (Ra/T) of the arithmetic mean roughness Ra at the surface of the graphite film to the thickness T is 0.1-30.
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Inventors:
MURAKAMI MUTSUAKI (JP)
TATAMI ATSUSHI (JP)
TACHIBANA MASAMITSU (JP)
TATAMI ATSUSHI (JP)
TACHIBANA MASAMITSU (JP)
Application Number:
PCT/JP2018/002957
Publication Date:
August 09, 2018
Filing Date:
January 30, 2018
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
H01L23/36; C01B32/205; C09J7/20; C09J201/00; H01L23/373; H05K7/20
Foreign References:
| JP2014133669A | 2014-07-24 | |||
| JP2010001191A | 2010-01-07 | |||
| JP2017071528A | 2017-04-13 | |||
| JP2014133669A | 2014-07-24 | |||
| JP2017017697A | 2017-01-19 |
Other References:
See also references of EP 3579270A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
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